BUF11702_16 Datasheet, PDF (18/28 Pages) Texas Instruments – MULTI-CHANNEL LCD GAMMA CORRECTION BUFFER

BUF11702
BUF07702
SLOS359F − MARCH 2001 − REVISED MAY 2004
COMPLETE LCD SOLUTION FROM TI
In addition to the BUFxx702 line of gamma correction
buffers, TI offers a complete set of ICs for the LCD panel
market, including source and gate drivers, various
power-supply solutions, and audio power solutions.
Figure 50 shows the total IC solution from TI.
AUDIO POWER AMPLIFIER FOR TV
SPEAKERS
The TPA3002D2 is a 7W (per channel) stereo audio
amplifier specifically targeted towards LCD monitors
and TVs. It offers highly efficient, filter-free Class-D
operation for driving bridge−tied stereo speakers. The
TPA3002D2 is designed to drive stereo speakers as low
as 8Ω without an output filter. The high efficiency of the
TPA3002D2 eliminates the need for external heatsinks
when playing music. Stereo speaker volume is
controlled with a dc voltage applied to the volume
control terminal offering a range of gain from −40dB to
+36dB. Line outputs, for driving external headphone
amplifier inputs, are also dc voltage−controlled with a
range of gain from −56dB to +20dB. An integrated +5V
regulated supply is provided for powering an external
headphone amplifier. The TPA3002D2 was released to
market in 2002. Texas Instruments offers a full line of
linear and switch-mode audio power amplifiers. For
more information, visit www.ti.com. For excellent audio
performance, TI recommends the OPA364 or OPA353
as headphone drivers.
www.ti.com
GENERAL POWERPAD DESIGN
CONSIDERATIONS
The BUF11702 is available in the thermally enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the
die is mounted; see Figures 51(a) and (b). This
arrangement results in the lead frame being exposed as
a thermal pad on the underside of the package; see
Figure 51(c). Due to this thermal pad having direct
thermal contact with the die, excellent thermal
performance is achieved by providing a good thermal
path away from the thermal pad.
The PowerPAD package allows for both assembly and
thermal management in one manufacturing operation.
During the surface-mount solder operation (when the
leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package.
Through the use of thermal paths within this copper
area, heat can be conducted away from the package
into either a ground plane or other heat-dissipating
device. Soldering the PowerPAD to the PCB is always
required, even with applications that have low power
dissipation. This provides the necessary thermal and
mechanical connection between the lead frame die pad
and the PCB.
The PowerPAD must be connected to the device’s most
negative supply voltage.
Figure 50. TI LCD Solution
18