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OPA4872 Datasheet, PDF (17/27 Pages) Texas Instruments – 4:1 High-Speed Multiplexer
OPA4872
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THERMAL ANALYSIS
Heatsinking or forced airflow may be required under
extreme operating conditions. Maximum desired
junction temperature sets the maximum allowed
internal power dissipation as discussed in this
document. In no case should the maximum junction
temperature be allowed to exceed +150°C.
Operating junction temperature (TJ) is given by TA +
PD × θJA. The total internal power dissipation (PD) is
the sum of quiescent power (PDQ) and additional
power dissipated in the output stage (PDL) to deliver
SBOS346C – JUNE 2007 – REVISED MARCH 2011
load power. Quiescent power is simply the specified
no-load supply current times the total supply voltage
across the part. PDL depends on the required output
signal and load; for a grounded resistive load, PDL is
at a maximum when the output is fixed at a voltage
equal to 1/2 of either supply voltage (for equal bipolar
supplies). Under this condition PDL = VS 2/(4 × RL),
where RL includes feedback network loading.
Note that it is the power in the output stage and not in
the load that determines internal power dissipation.
en
OPA4872
4kT = 1.6 x 10-20J
at 290K
RS
ini
VRS = Ö4kTRS
eo
RF
VRF = Ö4kTRF
iin
RG
ÖiRG
4kT
RG
Figure 35. OPA4872 Noise Analysis Model
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Product Folder Link(s): OPA4872
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