TLV2371-Q1_15 Datasheet, PDF (16/28 Pages) Texas Instruments – FAMILY OF 550-muA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS

TLV2371-Q1, TLV2372-Q1, TLV2374-Q1
FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS
SGLS244A − MAY 2004 − REVISED JUNE 2008
APPLICATION INFORMATION
general power dissipation considerations
For a given θ_JA, the maximum power dissipation is shown in Figure 32 and is calculated by the following formula:
ǒ Ǔ PD +
TMAX–TA
q_JA
Where:
P_D = Maximum power dissipation of TLV237x IC (watts)
T_MAX = Absolute maximum junction temperature (150°C)
T_A = Free-ambient air temperature (°C)
θ_JA = θ_JC + θ_CA
θ_JC = Thermal coefficient from junction to case
θ_CA = Thermal coefficient from case to ambient air (°C/W)
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
2
1.75
PDIP Package
Low-K Test PCB
θ_JA = 104°C/W
T_J = 150°C
1.5
1.25
1
SOIC Package
Low-K Test PCB
θ_JA = 176°C/W
MSOP Package
Low-K Test PCB
θ_JA = 260°C/W
0.75
0.5
0.25 SOT-23 Package
Low-K Test PCB
0 ^{θJA = 324°C/W}
−55 −40 −25 −10 5
20 35 50 65 80 95 110 125
T_A − Free-Air Temperature − °C
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 32.
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