OPA350UA Datasheet, PDF (16/28 Pages) Texas Instruments – High-Speed, Single-Supply, Rail-to-Rail OPERATIONAL AMPLIFIERS

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
OPA350UA/2K5
OPA350UA/2K5G4
OPA350UAG4
OPA4350EA/250
OPA4350EA/250G4
OPA4350EA/2K5
OPA4350EA/2K5G4
OPA4350UA
OPA4350UA/2K5
OPA4350UA/2K5G4
OPA4350UAG4
Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C)
(1)
Drawing
Qty
(2)
(3)
ACTIVE
SOIC
D
8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SOIC
D
8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SOIC
D
8
75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SSOP
DBQ 16
250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
ACTIVE
SSOP
DBQ 16
250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
ACTIVE
SSOP
DBQ 16 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SSOP
DBQ 16 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SOIC
D
14
50 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
ACTIVE
SOIC
D
14 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
ACTIVE
SOIC
D
14 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
ACTIVE
SOIC
D
14
50 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
OPA
350UA
OPA
350UA
OPA
350UA
OPA
4350EA
OPA
4350EA
OPA
4350EA
OPA
4350EA
OPA4350UA
OPA4350UA
OPA4350UA
OPA4350UA
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Samples
Addendum-Page 2