OPA2180 Datasheet, PDF (16/25 Pages) Texas Instruments – 0.1-μV/°C Drift, Low-Noise, Rail-to-Rail Output, 36-V, Zero-Drift OPERATIONAL AMPLIFIERS

PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2012
PACKAGING INFORMATION
Orderable Device
OPA2180ID
OPA2180IDGK
OPA2180IDGKR
OPA2180IDR
OPA4180ID
OPA4180IDR
OPA4180IPW
OPA4180IPWR
Status ^{(1) Package Type Package}
Drawing
ACTIVE
SOIC
D
Pins
8
Package Qty
75
PREVIEW VSSOP
DGK
8
PREVIEW VSSOP
DGK
8
ACTIVE
SOIC
D
8
80
2500
2500
PREVIEW
SOIC
D
14
50
PREVIEW
SOIC
D
14
2500
PREVIEW TSSOP
PW
14
90
PREVIEW TSSOP
PW
14
2000
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
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(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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