LP2960IMX-33 Datasheet, PDF (15/24 Pages) Texas Instruments – LP2960 Adjustable Micropower 0.5A Low-Dropout Regulators

LP2960
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SNVS112C – APRIL 1999 – REVISED APRIL 2013
The table below shows measured values of θ_(J−A) for a PC board with 1 ounce copper weight:
Package
DIP
Surface Mount SOIC
L (in.)
1
2
1
2
H (in.)
0.5
0.2
0.5
0.2
θ_J−A(°C/W)
50
52
72
74
As the heat must transfer from the copper to the surrounding air, best results (lowest θ_J−A) will be obtained by
using a surface copper layer with the solder resist opened up over the heatsink area.
If an internal copper layer of a multi-layer board is used for heatsinking, the board material acts as an insulator,
inhibiting heat transfer and increasing θ_J−A.
As with any heatsink, increasing the airflow across the board will significantly improve the heat transfer.
Typical Applications
Figure 29. Low T.C. Current Sink
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