UCD3138_16 Datasheet, PDF (13/89 Pages) Texas Instruments – Highly Integrated Digital Controller for Isolated Power

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UCD3138
SLUSAP2G – MARCH 2012 – REVISED SEPTEMBER 2016
5 Specifications
5.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
V33D
V33D to DGND
–0.3
3.8
V
V33DIO
V33DIO to DGND
–0.3
3.8
V
V33A
V33A to AGND
–0.3
3.8
V
BP18
BP18 to DGND
–0.3
2.5
V
|DGND – AGND|
Ground difference
0.3
V
All pins, excluding
AGND ⁽²⁾
Voltage applied to any pin
–0.3
3.8
V
T_J
Junction temperature
T_stg
Storage temperature
–40
150
°C
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Referenced to DGND
5.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V33D
V33DIO
V33A
T_J
BP18
Digital power
Digital I/O power
Analog power
Junction temperature
1.8-V digital power
MIN NOM MAX UNIT
3.0 3.3 3.6 V
3.0 3.3 3.6
3.0 3.3 3.6 V
–40
125 °C
1.6 1.8 2.0 V
5.4 Thermal Information
THERMAL METRIC⁽¹⁾
UCD3138
64 PIN QFN
(RGC)
UCD3138 UCD3138
40 PIN QFN 40 PIN QFN
(RHA)
(RMH)
UCD3138
40 PIN QFN
(RJA)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
25.1
31.8
31.0
10.5
18.5
16.5
4.6
6.8
6.3
0.2
0.2
0.2
4.6
6.7
6.3
1.2
1.8
1.1
30.1
°C/W
13.5
°C/W
4.9
°C/W
0.2
°C/W
4.8
°C/W
0.7
°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics application report.
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Specifications
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