TSB41LV06A_16 Datasheet, PDF (13/52 Pages) Texas Instruments – IEEE 1394b SIX-PORT CABLE TRANSCEIVER/ARBITER

TSB41LV06A
IEEE 1394a SIXĆPORT CABLE TRANSCEIVER/ARBITER
SLLS363A − SEPTEMBER 1999 − REVISED NOVEMBER 2000
thermal characteristics
R_θJA
PARAMETER
Junction-to-free-air thermal resistance
R_θJC Junction-to-case-thermal resistance
TEST CONDITION†
Board mounted, No air flow,
High conductivity TI recommended test board,
Chip soldered or greased to thermal land with 1 oz.
copper
R_θJA Junction-to-free-air thermal resistance
R_θJC Junction-to-case-thermal resistance
Board mounted, No air flow,
High conductivity TI recommended test board with
thermal land but no solder or grease thermal
connection to thermal land with 1 oz. copper
R_θJA
R_θJC
Junction-to-free-air thermal resistance
Junction-to-case-thermal resistance
Board mounted, No air flow,
High conductivity JEDEC test board with 1 oz.
copper
† _{Usage of thermally enhanced PowerPad PZP package is assumed in all three test conditions.}
MIN TYP MAX UNIT
17.85
0.12
°C/W
28.22
0.12
49.17
3.11
°C/W
°C/W
switching characteristics
PARAMETER
Jitter, transmit
Skew, transmit
tr TP differential rise time, transmit
tf TP differential fall time, transmit
tsu Setup time, CTL0, CTL1, D0−D7, LREQ to SYSCLK
th Hold time, CTL0, CTL1, D0−D7, LREQ after SYSCLK
td Delay time, SYSCLK to CTL0, CTL1, D0−D7
‡ _{Test Conditions: 3.3 VCC, TA = 25°C}
TEST CONDITION
Between TPA and TPB
Between TPA and TPB
10% to 90%, At 1394 connector
90% to 10%, At 1394 connector
50% to 50% See Figure 2
50% to 50% See Figure 2
50% to 50% See Figure 3
MIN TYP MAX UNIT
±0.15 ns
±0.10 ns
0.5
1.2 ns
0.5
1.2 ns
5
ns
2
ns
2‡
ns
PARAMETER MEASUREMENT INFORMATION
TPAx+
TPBx+
56 Ω
TPAx−
TPBx−
Figure 1. Test Load Diagram
SYSCLK
th
tsu
Dx, CTLx, LREQ
Figure 2. Dx, CTLx, LREQ Input Setup and Hold Time Waveforms
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