OPA373_16 Datasheet, PDF (13/37 Pages) Texas Instruments – CMOS Operational Amplifier

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DFN PACKAGE
The OPA2373 is available in a DFN-10 package (also
known as SON), which is a QFN package with lead
contacts on only two sides of the bottom of the package.
This leadless, near-chip-scale package maximizes board
space and enhances thermal and electrical characteristics
through an exposed pad. DFN packages are physically
small, have a smaller routing area, improved thermal
performance, and improved electrical parasitics, with a
pinout scheme that is consistent with other
commonly-used packages, such as SO and MSOP.
Additionally, the absence of external leads eliminates
bent-lead issues.
The DFN package can be easily mounted using standard
PCP assembly techniques. See Application Note,
QFN/SON PCB Attachment (SLUA271) and Application
Report, Quad Flatpack No-Lead Logic Packages
(SCBA017), both available for download at www.ti.com.
The exposed leadframe die pad on the bottom of the
package should be connected to V−.
OPA373, OPA2373
OPA374
OPA2374, OPA4374
SBOS279E − SEPTEMBER 2003 − REVISED MAY 2008
LAYOUT GUIDELINES
The leadframe die pad should be soldered to a thermal pad
on the PCB. A mechanical data sheet showing an example
layout is attached at the end of this data sheet.
Refinements to this layout may be required based on
assembly process requirements.
Mechanical drawings located at the end of this data sheet
list the physical dimensions for the package and pad. The
five holes in the landing pattern are optional, and are
intended for use with thermal vias that connect the
leadframe die pad to the heatsink area on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests.
Even with applications that have low-power dissipation,
the exposed pad must be soldered to the PCB to provide
structural integrity and long-term reliability.
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