LP3891 Datasheet, PDF (13/19 Pages) National Semiconductor (TI) – 0.8A Fast-Response Ultra Low Dropout Linear

PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2014
PACKAGING INFORMATION
Orderable Device
LP3891EMR-1.2
Status
(1)
NRND
Package Type Package Pins Package
Drawing
Qty
SO PowerPAD DDA 8
95
Eco Plan
(2)
TBD
Lead/Ball Finish
(6)
Call TI
MSL Peak Temp
(3)
Call TI
Op Temp (°C)
-40 to 125
LP3891EMR-1.2/NOPB
LP3891EMR-1.8/NOPB
LP3891EMRX-1.2/NOPB
LP3891ES-1.2
LP3891ES-1.2/NOPB
LP3891ES-1.5/NOPB
LP3891ESX-1.2/NOPB
LP3891ESX-1.5/NOPB
ACTIVE SO PowerPAD DDA
ACTIVE SO PowerPAD DDA
ACTIVE SO PowerPAD DDA
NRND
DDPAK/
KTT
TO-263
ACTIVE DDPAK/
KTT
TO-263
ACTIVE DDPAK/
KTT
TO-263
ACTIVE DDPAK/
KTT
TO-263
ACTIVE DDPAK/
KTT
TO-263
8
95 Green (RoHS
& no Sb/Br)
8
95 Green (RoHS
& no Sb/Br)
8 2500 Green (RoHS
& no Sb/Br)
5
45
TBD
5
45 Pb-Free (RoHS
Exempt)
5
45 Pb-Free (RoHS
Exempt)
5
500 Pb-Free (RoHS
Exempt)
5
500 Pb-Free (RoHS
Exempt)
CU SN
CU SN
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
Level-3-260C-168 HR -40 to 125
Level-3-260C-168 HR -40 to 125
Level-3-260C-168 HR -40 to 125
Call TI
-40 to 125
Level-3-245C-168 HR -40 to 125
Level-3-245C-168 HR -40 to 125
Level-3-245C-168 HR -40 to 125
Level-3-245C-168 HR -40 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
3891E
MR1.2
3891E
MR1.2
3891E
MR1.8
3891E
MR1.2
LP3891ES
-1.2
LP3891ES
-1.2
LP3891ES
-1.5
LP3891ES
-1.2
LP3891ES
-1.5
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Samples
Addendum-Page 1