ISO7520C_15 Datasheet, PDF (13/25 Pages) Texas Instruments – Low-Power 5 kVRMS Dual-Channel Digital Isolators

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empty para for space above the NOTE
ISO7520C, ISO7521C
SLLSE39E – JUNE 2010 – REVISED MAY 2015
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit-board (PCB) do not reduce this distance.
Creepage and clearance on a PCB become equal according to the measurement
techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or
ribs on a printed circuit board are used to help increase these specifications.
8.3.4 Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the I/O can allow low resistance to ground or the supply and, without current-limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER
Is Safety input, output, or supply current
Ts Maximum Case Temperature
TEST CONDITIONS
θ_JA =79.9°C/W, V_I = 5.25 V, T_J = 150°C, T_A = 25°C
θ_JA =79.9°C/W, V_I = 3.45 V, T_J = 150°C, T_A = 25°C
MIN TYP MAX UNIT
298
mA
453
150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Information table is that of a device installed on a High-K Test Board for Leaded Surface-Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
500
V_CC1 and V_CC2 at 3.45 V
400
300
V_CC1 and V_CC2 at 5.25 V
200
100
0
0
50
100
150
200
250
Case Temperature - °C
Figure 8. DW-16 R_ΘJC Thermal Derating Curve for VDE
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