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ADS7809 Datasheet, PDF (13/20 Pages) Burr-Brown (TI) – 16-Bit 10ms Serial CMOS Sampling ANALOG-to-DIGITAL CONVERTER
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2015
PACKAGING INFORMATION
Orderable Device
ADS7809P
ADS7809PB
ADS7809U
ADS7809U/1K
ADS7809U/1KE4
ADS7809UB
ADS7809UB/1K
ADS7809UBE4
ADS7809UBG4
ADS7809UE4
ADS7809UG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
OBSOLETE PDIP
N
20
TBD
OBSOLETE PDIP
N
20
TBD
NRND
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20 1000 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20 1000 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20 1000 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
NRND
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
Call TI
Call TI
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
CU NIPDAU-DCC
MSL Peak Temp Op Temp (°C)
(3)
Call TI
Call TI
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
ADS7809U
ADS7809U
ADS7809U
ADS7809U
B
ADS7809U
B
ADS7809U
B
ADS7809U
B
ADS7809U
ADS7809U
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Samples
Addendum-Page 1