TLV700XX_12 Datasheet, PDF (12/34 Pages) Texas Instruments – 200-mA, Low-IQ, Low-Dropout Regulator for Portable Devices

TLV700xx
SLVSA00C – SEPTEMBER 2009 – REVISED JULY 2011
www.ti.com
(1) Publication IPC-7351 is recommended for alternate designs.
(2) For more information, refer to TI application notes SCBA017 and SLUA271 (Quad Flatpack No-Lead Logic Packages
and QFN/SON PCB Attachment, respectively) for specific thermal information, via requirements, and additional
recommendations for board layout. These documents are available at the Texas Instruments web site
(http://www.ti.com) by searching for the literature number.
(3) Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release. Customers
should contact their board assembly site for stencil design recommendations. Refer to IPC-7525 for stencil design
considerations.
(4) Customers should contact their board fabrication site for minimum solder mask tolerances between signal pads.
Figure 22. Recommended Land Pattern for DSE Package
12
Copyright © 2009–2011, Texas Instruments Incorporated