TL750L05 Datasheet, PDF (11/29 Pages) Texas Instruments – LOW-DROPOUT VOLTAGE REGULATORS

PACKAGE OPTION ADDENDUM
www.ti.com
21-Apr-2012
Orderable Device
TL751L10QP
TL751L12CD
TL751L12CDE4
TL751L12CDG4
TL751L12CDR
TL751L12CDRE4
TL751L12CDRG4
TL751L12CP
TL751L12MFKB
TL751L12MJGB
TL751L12QD
TL751L12QDR
TL751L12QP
Status ^{(1) Package Type Package}
Drawing
OBSOLETE PDIP
P
ACTIVE
SOIC
D
Pins
8
8
Package Qty
75
ACTIVE
SOIC
D
8
75
ACTIVE
SOIC
D
8
75
ACTIVE
SOIC
D
8
2500
ACTIVE
SOIC
D
8
2500
ACTIVE
SOIC
D
8
2500
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
PDIP
LCCC
CDIP
SOIC
SOIC
PDIP
P
8
FK
20
JG
8
D
8
D
8
P
8
Eco Plan ⁽²⁾
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
TBD
TBD
TBD
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
Call TI Call TI
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 5