DRV101_15 Datasheet, PDF (11/27 Pages) Texas Instruments – PWM SOLENOID/VALVE DRIVER

+5V
5kΩ
Flag 7
Thermal Shutdown
Over/Under Current
(LED)
HLMP-Q156
6
Out
DRV101
4
FIGURE 8. LED to Indicate Fault Condition.
Over/Under Current Fault
An over-current fault occurs when the output current is
greater than approximately 2.3A. The status flag is not
latched. Since current during PWM mode is switched on and
off, the flag output will be modulated with PWM timing (see
flag waveforms in the Typical Performance Curves).
An under-current fault occurs when the output current is
below the under-scale current threshold (typically 23mA).
For example, this function indicates when the load is discon-
nected. Again, the flag output is not latched, so an under-
current condition during PWM mode will produce a flag
output that is modulated by the PWM waveform. An initial,
brief under-current flag normally appears driving inductive
loads and may be avoided by adding a parallel resistor
sufficient to move the initial current above the under-current
threshold. An under-current flag may not appear for case
temperatures above 100°C. Avoid adding capacitance to pin
6 (Out) as it may cause momentary current limiting.
Over-Temperature Fault
A thermal fault occurs when the die reaches approximately
165°C, producing a similar effect as pulling the input low.
Internal shutdown circuitry disables the output and resets the
Delay Adjust pin. The Flag is latched in the low state (fault
condition) until the die has cooled to approximately 150°C.
A thermal fault can occur in any mode of operation. Recov-
ery from thermal fault will start in delay mode (constant dc
output).
PACKAGE MOUNTING
Figure 9 provides recommended PCB layouts for both the
TO-220 and DDPAK power packages. The tab of both
packages is electrically connected to ground (pin 4). It may
be desirable to isolate the tab of TO-220 package from its
mounting surface with a mica (or other film) insulator (see
7-Lead TO-220
KVT Package⁽²⁾
7-Lead DDPAK⁽¹⁾
KTW Package⁽²⁾
0.51
0.05
0.04
0.105
0.05
0.035
Mean dimensions in inches. Refer to end of data sheet
for tolerances and detailed package drawings.
NOTES: (1) For improved thermal performance increase footprint area.
See Figure 11, Thermal Resistance vs Circuit Board Copper Area.
(2) Refer to the mechanical drawings at the end of this document.
FIGURE 9. TO-220 and DDPAK Solder Footprints.
DRV101
11
SBVS008B
www.ti.com