TPS65983 Datasheet, PDF (105/114 Pages) Texas Instruments – USB Type-C and USB PD Controller, Power Switch, and High Speed Multiplexer

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TPS65983
SLVSD93 – OCTOBER 2015
12.2.7 Void Via Placement
The void under the TPS65983 is used to via out I/O and for thermal relief vias. A minimum of 6 vias must be
used for thermal dissipation to the GND planes. The thermal relief vias must be placed on the right side of the
device by the power path. Figure 101 shows the recommended placement of the vias. Note the areas under the
void where vias are not placed. This is done in order to allow the external FET gate drive and sense pins to route
under the TPS65983 through an inner layer. Figure 102 shows the top layer GND pour to connect the vias and
GND balls together.
Figure 101. Void Via Placement
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