TLC542 Datasheet, PDF (10/12 Pages) Texas Instruments – 8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL AND 11 INPUTS

PACKAGE OPTION ADDENDUM
www.ti.com
25-May-2009
PACKAGING INFORMATION
Orderable Device
TLC542CDW
TLC542CDWG4
TLC542CDWR
TLC542CDWRG4
TLC542CN
TLC542CNE4
TLC542IDW
TLC542IDWG4
TLC542IDWR
TLC542IDWRG4
TLC542IFN
TLC542IFNG3
TLC542IFNR
TLC542IFNRG3
TLC542IN
TLC542INE4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
Package
Drawing
DW
SOIC
DW
SOIC
DW
SOIC
DW
PDIP
N
PDIP
N
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
PLCC
FN
PLCC
FN
PLCC
FN
PLCC
FN
PDIP
N
PDIP
N
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 46 Green (RoHS & CU SN Level-1-260C-UNLIM
no Sb/Br)
20 46 Green (RoHS & CU SN Level-1-260C-UNLIM
no Sb/Br)
20 1000 Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
20 1000 Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1