LP3882 Datasheet, PDF (10/19 Pages) National Semiconductor (TI) – 1.5A Fast-Response Ultra Low Dropout Linear

LP3882
SNVS226F – MARCH 2003 – REVISED APRIL 2013
www.ti.com
HEATSINKING TO-220 PACKAGE
The thermal resistance of a TO-220 package can be reduced by attaching it to a heat sink or a copper plane on
a PC board. If a copper plane is to be used, the values of θ_JA will be same as shown in next section for
DDPAK/TO-263 package.
The heatsink to be used in the application should have a heatsink to ambient thermal resistance,
θ_HA≤ θ_JA − θ_CH − θ_JC.
In this equation, θ_CH is the thermal resistance from the case to the surface of the heat sink and θ_JC is the thermal
resistance from the junction to the surface of the case. θ_JC is about 3°C/W for a TO-220 package. The value for
θ_CH depends on method of attachment, insulator, etc. θ_CH varies between 1.5°C/W to 2.5°C/W. If the exact value
is unknown, 2°C/W can be assumed.
HEATSINKING DDPAK/TO-263 PACKAGE
The DDPAK/TO-263 package uses the copper plane on the PCB as a heatsink. The tab of these packages are
soldered to the copper plane for heat sinking. The graph below shows a curve for the θ_JA of DDPAK/TO-263
package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the
copper area for heat sinking.
Figure 21. θ_JA vs Copper (1 Ounce) Area for DDPAK/TO-263 package
As shown in the graph below, increasing the copper area beyond 1 square inch produces very little improvement.
The minimum value for θ_JA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 22 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming θ_JA is 35°C/W and the maximum junction temperature is 125°C.
Figure 22. Maximum Power Dissipation vs Ambient Temperature For DDPAK/TO-263 Package
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