WL1271-TIWI-BLE Datasheet, PDF (1/2 Pages) Texas Instruments – WLAN 802.11 b/g/n and Bluetooth v4.0

Not Recommended for New Designs
www.ti.com
WLAN 802.11 b/g/n and Bluetooth^® v4.0
WL1271-TiWi-BLE
SWRS153 – JULY 2013
FEATURES
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•234 IEEE 802.11 b/g/n Wi-Fi
• Typical WLAN Transmit Power:
– +12.5 dBm, 65 Mbps, OFDM (n), 2.4 GHz
– +20 dBm, 11 Mbps, CCK (b), 2.4 GHz
• Typical WLAN Receiver Sensitivity:
– -73 dBm, 65 Mbps, OFDM (n), 2.4 GHz
– -89 dBm, 11 Mbps, CCK (b), 2.4 GHz
• Bluetooth v4.0 Including Bluetooth Low
Energy
• Bluetooth Power Class 1.5
• Best-In-Class WLAN and Bluetooth
Coexistence Technology on a Single-Chip
• Enhanced Low Power ( ELP™) Technology for
Extended Battery Life
• On Module Reference Oscillator, DC-DC
Voltage Regulation, and U.FL Coaxial
• Pre-Integration with TI’s Sitara Platform
Processors and Others with a COM Connector
• Software Upgradable for ANT
• Dimensions: 18 x 13 x 1.9 mm
• Cost Saving Module Level Certification
Accepted Worldwide: FCC (USA), IC (Canada),
and CE (Europe)
• Operating Temperature Range: -40°C to +85°C
APPLICATIONS
• Consumer Electronics
• Smart Energy
• Industrial
• Medical
• Security
• Video and Imaging Among Others
DESCRIPTION
The following product brief applies to LS Research
Wi-Fi + Bluetooth module, series name: TiWi-BLE.
The Wi-Fi + Bluetooth chip used is the WL1271L from
Texas Instruments.
The WL1271-BLE is a fully-integrated high
performance module offered by LS Research utilizing
TI’s single-chip WL1271 Dual Band (2.4 GHz) IEEE
802.11 b/g/n and Bluetooth v4.0 BLE Transceiver.
Based on TI’s 6th generation Wi-Fi technology and
7th generation Bluetooth technology, the solution
provides best-in-class coexistence capabilities
coupled with TI’s Enhanced Low Power (ELP™)
technology. The WL1271-BLE is provided as a
module to help customers reduce development time,
lower manufacturing costs, save board space, ease
certification, and minimize RF expertise required. For
evaluation and development, platforms are available
which integrate the WL1271-BLE module, Linux Wi-Fi
drivers, Bluetooth stack, and sample source
applications running on a TI host processor (AM335x,
AM37xx, and AM1810).
The full specification and purchasing of the WL1271-
BLE module can be found on LS Research's website
(http://www.lsr.com/wireless-products/tiwi-ble). More
information on TI’s wireless platform solutions can be
found on the Wireless Connectivity Wiki
(www.ti.com/connectivitywiki).
Disclaimer
All content in and linked to this product brief is provided by TI "AS IS" without express or implied warranties of
any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of
the third party products or services referenced on this product brief. This information is provided subject to TI’s
Terms of Use.
Please be aware that an important notice concerning availability, standard warranty, and use in critical
applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this
data sheet.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ELP is a trademark of Texas Instruments.
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Bluetooth is a registered trademark of Bluetooth SIG.
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All other trademarks are the property of their respective owners.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated