TXB0108_16 Datasheet, PDF (1/32 Pages) Texas Instruments – TXB0108 8-Bit Bidirectional Voltage-Level Translator with Auto-Direction Sensing

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TXB0108
SCES643F – NOVEMBER 2006 – REVISED NOVEMBER 2014
TXB0108 8-Bit Bidirectional Voltage-Level Translator with Auto-Direction Sensing and
±15-kV ESD Protection
1 Features
•1 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
B Port (V_CCA ≤ V_CCB)
• V_CC Isolation Feature – If Either V_CC Input Is at
GND, All Outputs Are in the High-Impedance
State
• OE Input Circuit Referenced to V_CCA
• Low Power Consumption, 4-μA Max I_CC
• I_off Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2000-V Human-Body Model (A114-B)
– 1000-V Charged-Device Model (C101)
– B Port
– ±15-kV Human-Body Model (A114-B)
– ±8-kV Human-Body Model (A114-B)
(YZP Package Only)
– 1000-V Charged-Device Model (C101)
2 Applications
• Handset
• Smartphone
• Tablet
• Desktop PC
3 Description
This 8-bit noninverting translator uses two separate
configurable power-supply rails. The A port is
designed to track V_CCA. V_CCA accepts any supply
voltage from 1.2 V to 3.6 V. The B port is designed to
track V_CCB. V_CCB accepts any supply voltage from
1.65 V to 5.5 V. This allows for universal low-voltage
bidirectional translation between any of the 1.2-V,
1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
V_CCA should not exceed V_CCB.
When the output-enable (OE) input is low, all outputs
are placed in the high-impedance state.
The TXB0108 is designed so that the OE input circuit
is supplied by V_CCA.
This device is fully specified for partial-power-down
applications using I_off. The I_off circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
To ensure the high-impedance state during power-up
or power-down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
Device Information⁽¹⁾
PART NUMBER PACKAGE
BODY SIZE (NOM)
TVSOP (20)
5.00 mm x 4.40 mm
SON (20)
2.00 mm x 4.00 mm
TXB0108
BGA MICROSTAR
JUNIOR (20)
TSSOP (20)
2.50 mm x 3.00 mm
6.50 mm x 4.40 mm
VQFN (20)
4.50 mm x 3.50 mm
DSGBA (20)
1.90 mm x 2.40 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Block Diagram for TXB010X
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.