TXB0104_17 Datasheet, PDF (1/34 Pages) Texas Instruments – 4-Bit Bidirectional Voltage-level Translator With Automatic Direction Sensing and 15-kV ESD Protection

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TXB0104
SCES650G – APRIL 2006 – REVISED NOVEMBER 2014
TXB0104 4-Bit Bidirectional Voltage-level Translator With Automatic Direction Sensing
and ±15-kV ESD Protection
1 Features
•1 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B
Port (V_CCA ≤ V_CCB)
• V_CC Isolation Feature – If Either V_CC Input Is at
GND, All Outputs Are in the High-Impedance
State
• OE Input Circuit Referenced to V_CCA
• Low Power Consumption, 5-μA Max I_CC
• I_off Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 1500-V Charged-Device Model (C101)
– B Port
– ±15-kV Human-Body Model (A114-B)
– 1500-V Charged-Device Model (C101)
2 Applications
• Headset
• Smartphone
• Tablet
• Desktop PC
3 Description
This 4-bit non-inverting translator uses two separate
configurable power-supply rails. The A port is
designed to track V_CCA. V_CCA accepts any supply
voltage from 1.2 V to 3.6 V. The B port is designed to
track V_CCB. V_CCB accepts any supply voltage from
1.65 V to 5.5 V. This allows for universal low-voltage
bidirectional translation between any of the 1.2-V,
1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
V_CCA should not exceed V_CCB.
When the output-enable (OE) input is low, all outputs
are placed in the high-impedance state. To ensure
the high-impedance state during power up or power
down, OE should be tied to GND through a pulldown
resistor; the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
The TXB0104 is designed so that the OE input circuit
is supplied by V_CCA.
This device is fully specified for partial-power-down
applications using I_off. The I_off circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information⁽¹⁾
PART NUMBER PACKAGE
BODY SIZE (NOM)
UQFN (12)
2.00 mm x 1.70 mm
SOIC (14)
8.65 mm x 3.91 mm
TXB0104
BGA
MICROSTAR
JUNIOR (12)
2.00 mm x 2.50 mm
TSSOP (14)
5.00 mm x 4.40 mm
VQFN (14)
3.50 mm x 3.50 mm
DSBGA (12)
1.40 mm x 1.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Block Diagram for TXB010X
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.