TXB0101_15 Datasheet, PDF (1/31 Pages) Texas Instruments – 1-Bit Bidirectional Level-Shifting and Voltage Translator

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TXB0101
SCES639C – JANUARY 2007 – REVISED JUNE 2015
TXB0101 1-Bit Bidirectional Level-Shifting and Voltage Translator
With Auto Direction-Sensing and ±15-kv ESD Protection
1 Features
• Available in the Texas Instruments NanoFree™
Package
• 1.2 V to 3.6 V on A Port and
1.65 V to 5.5 V on B Port (V_CCA ≤ V_CCB)
• V_CC Isolation Feature – If Either V_CC Input is at
GND, All Outputs are in the High-Impedance State
• OE Input Circuit Referenced to V_CCA
• Low Power Consumption, 5 μA Maximum I_CC
• I_off Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2000 V Human Body Model (A114-B)
– 250 V Machine Model (A115-A)
– 1500 V Charged-Device Model (C101)
– B Port
– 15 kV Human Body Model (A114-B)
– 250 V Machine Model (A115-A)
– 1500 V Charged-Device Model (C101)
2 Applications
• Handsets
• Smartphones
• Tablets
• Desktop PCs
1
3 Description
This 1-bit noninverting translator uses two separate
configurable power-supply rails. The A port is
designed to track V_CCA. V_CCA accepts any supply
voltage from 1.2 V to 3.6 V. The B port is designed to
track V_CCB. V_CCB accepts any supply voltage from
1.65 V to 5.5 V. This allows for universal low-voltage
bidirectional translation between any of the 1.2-V,
1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
V_CCA should not exceed V_CCB.
When the output-enable (OE) input is low, all outputs
are placed in the high-impedance state.
This device is fully specified for partial-power-down
applications using I_off. The I_off circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
To ensure the high-impedance state during power up
or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
Device Information⁽¹⁾
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOT-23 (6)
2.90 mm × 1.60 mm
TXB0101
SC70 (6)
SOT (6)
2.00 mm × 1.25 mm
1.60 mm × 1.20 mm
DSBGA (6)
1.1 mm × 1.20 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Operating Circuit
1.8 V
1.8-V
System
Controller
Data
V_CCA
OE
V_CCB
TXB0101
A
B
3.3-V
System
Data
3.3 V
GND
GND
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.