TS3A226E Datasheet, PDF (1/11 Pages) Texas Instruments – Autonomous Audio Headset Switch with Reduced GND Switch

Not Recommended for New Designs
www.ti.com
TS3A226E
SCDS340 – MARCH 2013
Autonomous Audio Headset Switch with Reduced GND Switch R_ON and FM Capability
Check for Samples: TS3A226E
FEATURES
1
• Ground FET Switches (60mΩ typical)
• Autonomous Detection of Headset Types:
3-Poles or 4-Poles (with MIC on SLEEVE or
RING2)
• Microphone Line Switches
• Supports FM Signal Transmission Through the
Ground FETs
• Reduction of Click/Pop Noise
• VDD Range: 2.6 V – 4.7 V
• THD (Mic): 0.002% Typical
• Low Current Consumption: 6.5-µA Typical
• ±8kV Contract Discharge (IEC 61000-4-2) ESD
Performance on SLEEVE and RING2 Pins
APPLICATIONS
• Mobile Phones / Tablet PCs
• Notebook/Ultrabook Computers
DESCRIPTION
The TS3A226E is an audio headset switch that
detects 3- or 4-pole 3.5mm accessories. For a 4-pole
accessory with a microphone, the TS3A226E also
detects the MIC location and routes the microphone
and ground signals automatically. The ground signal
is routed through a pair of low-impedance ground
FETs (60mΩ typical), resulting minimal impact on
audio cross-talk performance. The autonomous
detection feature allows end users to plug in
accessories with different audio pole configurations
into the mobile device and have them operate
properly with no added software control and
complexity. The ground FETs of the device are
designed to allow FM signal pass-through, making it
possible to use the ground line of the headset as an
FM antenna in mobile audio application.
The TS3A226E is packaged within a 1.2mm × 1.2mm
WCSP package, making it suitable for use in mobile
application.
MIC_BIAS
R1
Audio
Codec ^MIC
C2
MICP
TS3A226E
S1
SLEEVE
RING2
TIP
RING1
VDD
EN
Control
Logic
FET2 FET1
GNDA GNDB
FM Receiver
Figure 1. Typical Application Diagram
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART
NUMBER
YFF- WCSP
Tape and reel
TS3A226EYFFR
TOP-SIDE MARKING
YP226E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated