TS3A225E_17 Datasheet, PDF (1/37 Pages) Texas Instruments – AUTONOMOUS AUDIO HEADSET SWITCH

TS3A225E
www.ti.com
SCDS329A – AUGUST 2012 – REVISED MAY 2013
AUTONOMOUS AUDIO HEADSET SWITCH
Check for Samples: TS3A225E
FEATURES
1
• V_DD Range = 2.7 V to 4.5 V
• Break Before Make Stereo Jack Switches
• Ron for Ground FET Switches
– WCSP Package: 70 mΩ
– QFN Package: 100 mΩ
• Autonomous Detection of GND and MIC
Connections
• Detection Triggered by I²C or External Trigger
Pin
• HDA Compatible MIC Present Indicator
• 1.8V Compatible I²C Switch Control
• ESD Performance Tested Per JESD 22:
– 2000-V Human-Body Model (A114-B, Class
II)
– 500-V Charged-Device Model (C101)
• ESD Performance (SLEEVE, RING2, TIP)
– ±8-kV Contact Discharge (IEC 61000-4-2)
APPLICATIONS
• Mobile Phones/ Tablet PCs
• Notebook Computers
DESCRIPTION
The TS3A225E is an audio headset switch device.
The device detects the presence of an analog
microphone and switches a system analog
microphone pin between different connectors in an
audio stereo jack. The microphone connection in a
stereo connector can be swapped with the ground
connection depending on manufacturer. When the
TS3A225E detects a certain configuration, the device
automatically connects the microphone line to the
appropriate pin. The device also reports the presence
of an analog microphone on an audio stereo jack.
In some systems, it is desirable to connect the stereo
jack pin to ground. The TS3A225E provides two
internal low resistance (<100mΩ) FET switches for
ground shorting.
MIC_BIAS
R1
TS3A225E
TIP
RING1
MICI
C1
C2
MIC_REF
C3
MICp
MICn / HP_REF
VDD
SCL
SDA
I2C_ADDR_SEL
/MIC_PRESENT
DET_TRIGGER
S1
Control
Logic
FET2
FET1
SLEEVE_SENSE
RING2_SENSE
SLEEVE
RING2
TIP_SENSE
GND
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
RTE - QFN
Tape and reel
TS3A225ERTER
YFF - WCSP
Tape and reel
TS3A225EYFFR
TOP-SIDE MARKING
ZTL
YP225E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated