TRF370417-DIE Datasheet, PDF (1/6 Pages) Texas Instruments – QUADRATURE MODULATOR

TRF370417-DIE
www.ti.com
SLWS242 – NOVEMBER 2013
QUADRATURE MODULATOR
Check for Samples: TRF370417-DIE
FEATURES
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• Low Noise Floor
• Single Supply: 4.5-V–5.5-V Operation
• Silicon Germanium Technology
APPLICATIONS
• Cellular Base Station Transceiver
• CDMA: IS95, UMTS, CDMA2000, TD-SCDMA
• TDMA: GSM, IS-136, EDGE/UWC-136
• Multicarrier GSM
• WiMAX: 802.16d/e
• 3GPP: LTE
• Point-to-Point (P2P) Microwave
• Wideband Software-Defined Radio
• Public Safety: TETRA/APC025
• Communication-System Testers
• Cable Modem Termination System (CMTS)
DESCRIPTION
The TRF370417-DIE is a low-noise direct quadrature modulator, capable of converting complex modulated
signals from baseband or IF directly up to RF. The TRF370417-DIE is a high-performance, superior-linearity
device that operates at RF. The modulator is implemented as a double-balanced mixer. The RF output block
consists of a differential to single-ended converter and an RF amplifier capable of driving a single-ended 50-Ω
load without any need of external components.
PRODUCT
TRF370417
PACKAGE
DESIGNATOR
TD
ORDERING INFORMATION⁽¹⁾
PACKAGE
ORDERABLE PART NUMBER
Bare die in waffle pack⁽²⁾
TRF370417TDA1
TRF370417TDA2
PACKAGE QUANTITY
169
10
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated