TPS82692_16 Datasheet, PDF (1/32 Pages) Texas Instruments – High-Efficiency MicroSIP Step-Down Converter (Profile <1mm)

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TPS82692, TPS82693, TPS826951
TPS82697, TPS82698
SLVSBF8C – MARCH 2013 – REVISED MAY 2015
TPS8269x High-Efficiency MicroSIP™ Step-Down Converter (Profile <1mm)
1 Features
•1 Total Solution Size <6.7 mm²
• 95% Efficiency at 3MHz Operation
• 23μA Quiescent Current
• High Duty-Cycle Operation
• Best in Class Load and Line Transient
• ±2% Total DC Voltage Accuracy
• Automatic PFM/PWM Mode Switching
• Low Ripple Light-Load PFM Mode
• Excellent AC Load Regulation
• Internal Soft Start, 200-µs Start-Up Time
• Integrated Active Power-Down Sequencing
(Optional)
• Current Overload and Thermal Shutdown
Protection
• Sub 1-mm Profile Solution
2 Applications
• Cell Phones, Smart-Phones
• Optical Data Modules
• Camera and Sensor Modules
• Wearable Devices
• LDO Replacement
3 Description
The TPS8269xSIP device is a complete 500mA /
800mA, DC/DC step-down power supply intended for
low-power applications. Included in the package are
the switching regulator, inductor and input/output
capacitors. No additional components are required to
finish the design. The TPS8269xSIP is based on a
high-frequency synchronous step-down dc-dc
converter optimized for battery-powered portable
applications. The MicroSIP™ DC/DC converter
operates at a regulated 3-MHz switching frequency
and enters the power-save mode operation at light
load currents to maintain high efficiency over the
entire load current range. The PFM mode extends the
battery life by reducing the quiescent current to 23μA
(typ) during light load operation. For noise-sensitive
applications, the device has PWM spread spectrum
capability providing a lower noise regulated output, as
well as low noise at the input. These features,
combined with high PSRR and AC load regulation
performance, make this device suitable to replace a
linear regulator to obtain better power conversion
efficiency. The TPS8269xSIP is packaged in a
compact (2.3mm x 2.9mm) and low profile (1.0mm)
BGA package suitable for automated assembly by
standard surface mount equipment.
Device Information
ORDER NUMBER
PACKAGE
BODY SIZE
TPS82692SIP
µSIP (8)
2,9mm × 2,3mm
TPS82693SIP
µSIP (8)
2,9mm × 2,3mm
TPS826951SIP
µSIP (8)
2,9mm × 2,3mm
TPS82697SIP
µSIP (8)
2,9mm × 2,3mm
TPS82698SIP
µSIP (8)
2,9mm × 2,3mm
4 Simplified Schematic
V_BAT
TPS82693SIP
DC/DC Converter
L
VIN
SW
C_I
GND
FB
ENABLE
EN
MODE
GND
.
V_OUT
2.85 V @ 800mA
C_O
MODE
SELECTION
Efficiency vs Output Current
100.0
95.0
90.0
85.0
80.0
75.0
70.0
65.0
60.0
TPS82693
55.0 _{VOUT = 2.85V}
MODE = Low
50.0
0.1
1
10
100
Current (mA)
1000
G000
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.