TPS8267XEVM Datasheet, PDF (1/13 Pages) Texas Instruments – The TPS82671 and TPS82675 devices are series of high-frequency, synchronous, step-down dc-dc converters optimized for battery-powered portable applications

User's Guide
SLVU383A – October 2010 – Revised November 2010
TPS8267xEVM
This user’s guide describes the characteristics, operation, and use of the TPS8267xEVM-646 evaluation
module (EVM). The TPS8267xEVM-646 is a fully assembled and tested platform for evaluating the
performance of the TPS82671 and TPS82675 high-frequency, synchronous, step-down dc-dc converters
optimized for battery-powered portable applications. This document includes schematic diagrams, a
printed circuit board (PCB) layout, bill of materials, and test data. Throughout this document, the
abbreviations EVM and TPS8267xEVM and the term evaluation module are synonymous with the
TPS8267xEVM-646 unless otherwise noted.
Contents
1 Introduction .................................................................................................................. 2
1.1 Features ............................................................................................................. 2
1.2 Applications ......................................................................................................... 2
1.3 EVM Ordering Options ............................................................................................ 2
2 TPS8267xEVM Schematic ................................................................................................. 3
3 Connector and Test Point Descriptions .................................................................................. 3
3.1 Input / Output Connectors: TPS8267xEVM .................................................................... 3
3.2 Jumpers and Switches ............................................................................................ 4
4 Test Configuration .......................................................................................................... 5
4.1 Hardware Setup .................................................................................................... 5
4.2 Procedure ........................................................................................................... 5
5 TPS8267xEVM Test Data ................................................................................................. 6
5.1 Thermal Performance ............................................................................................. 6
6 TPS8267xEVM Assembly Drawings and Layout ....................................................................... 8
7 Bill of Materials ............................................................................................................. 11
8 Marking Information ....................................................................................................... 11
List of Figures
1 TPS8267xEVM Schematic................................................................................................. 3
2 Hardware Board Connection .............................................................................................. 5
3 Top Side Thermal Measurement.......................................................................................... 6
4 Bottom Side Thermal Measurement...................................................................................... 7
5 TPS8267xEVM Component Placement (Top View).................................................................... 8
6 TPS8267xEVM Top-Side Copper (Top View)........................................................................... 9
7 TPS8267xEVM Bottom-Side Copper (Bottom View) ................................................................. 10
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SLVU383A – October 2010 – Revised November 2010
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TPS8267xEVM
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