TPS82671_11 Datasheet, PDF (1/28 Pages) Texas Instruments – 600-mA, HIGH-EFFICIENCY MicroSiP STEP-DOWN CONVERTER (PROFILE <1.0mm)

TPS82671
TPS82675, TPS82677
www.ti.com
SLVSAI0A – OCTOBER 2010 – REVISED APRIL 2011
600-mA, HIGH-EFFICIENCY MicroSiP™ STEP-DOWN CONVERTER (PROFILE <1.0mm)
Check for Samples: TPS82671, TPS82675, TPS82677
FEATURES
1
•23 90% Efficiency at 5.5MHz Operation
• 17μA Quiescent Current
• Wide V_IN Range From 2.3V to 4.8V
• 5.5MHz Regulated Frequency Operation
• Spread Spectrum, PWM Frequency Dithering
• Best in Class Load and Line Transient
• ±2% Total DC Voltage Accuracy
• Automatic PFM/PWM Mode Switching
• Low Ripple Light-Load PFM Mode
• ≥35dB V_IN PSRR (1kHz to 10kHz)
• Internal Soft Start, 120-µs Start-Up Time
• Integrated Active Power-Down Sequencing
(Optional)
• Current Overload and Thermal Shutdown
Protection
• Sub 1-mm Profile Solution
• Total Solution Size <6.7 mm²
APPLICATIONS
• Cell Phones, Smart-Phones
• Digital TV, WLAN, GPS and Bluetooth™
Applications
• POL Applications
DESCRIPTION
The TPS8267x device is a complete 600mA, DC/DC
step-down power supply intended for low-power
applications. Included in the package are the
switching regulator, inductor and input/output
capacitors. No additional components are required to
finish the design.
The TPS8267x is based on a high-frequency
synchronous step-down dc-dc converter optimized for
battery-powered portable applications. The
MicroSiP^TM DC/DC converter operates at a regulated
5.5-MHz switching frequency and enters the
power-save mode operation at light load currents to
maintain high efficiency over the entire load current
range.
The PFM mode extends the battery life by reducing
the quiescent current to 17μA (typ) during light load
operation. For noise-sensitive applications, the device
has PWM spread spectrum capability providing a
lower noise regulated output, as well as low noise at
the input. These features, combined with high PSRR
and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
better power conversion efficiency.
The TPS8267x is packaged in a compact (2.3mm x
2.9mm) and low profile (1.0mm) BGA package
suitable for automated assembly by standard surface
mount equipment.
TPS82671SIP
V_IN
2.3 V .. 4.8 V
C_I
DC/DC Converter
L
VIN
SW
GND
FB
ENABLE
EN
MODE
V_OUT
1.8 V @ 600mA
C_O
MODE
SELECTION
GND
Figure 1. Typical Application
100
250
V_I = 3.6 V,
90 _{VO = 1.8 V}
225
80
Efficiency
200
PFM/PWM Operation
70
175
60
150
50
125
40
100
30
20
10
0
0.1
Power Loss
PFM/PWM Operation
1
10
100
I_O - Load Current - mA
75
50
25
0
1000
Figure 2. Efficiency vs. Load Current
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroSiP is a trademark of Texas Instruments.
2
Bluetooth is a trademark of Bluetooth SIG, Inc.
3
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2011, Texas Instruments Incorporated