TPS718XX_17 Datasheet, PDF (1/26 Pages) Texas Instruments – Dual, 200mA Output, Low Noise, High PSRR Low-Dropout Linear Regulators

TPS718xx
TPS719xx
www.ti.com..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
Dual, 200mA Output, Low Noise, High PSRR
Low-Dropout Linear Regulators
FEATURES
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•23 Dual, 200mA High-Performance LDOs
• Low Total Quiescent Current: 90µA with Both
LDOs Enabled
• Low Noise: 70µV_RMS/V
• Active Output Pulldown (TPS719xx)
• Independent Enables for Each LDO
• PSRR: 65dB at 1kHz, 45dB at 1MHz
• Available in Multiple Fixed-Output Voltage
Combinations from 0.9V to 3.6V Using
Innovative Factory EEPROM Programming
• Fast Start-Up Time: 160µs
• Over-Current, Over-Temperature and
Under-Voltage Protection
• Low Dropout: 230mV at 200mA
• Stable with 1µF Ceramic Output Capacitor
• Available in 2mm × 2mm SON-6 and 6-Ball
WCSP Packages
APPLICATIONS
• Digital Cameras and Camera Modules
• Cellular Camera and TV Phones
• Wireless LAN, Bluetooth^®
• Handheld Products
DESCRIPTION
The TPS718xx and TPS719xx families of low-dropout
(LDO) regulators offer a high power-supply rejection
ratio (PSRR), low noise, fast start-up, and excellent
line and load transient responses while consuming a
very low 90µA (typical) at no load ground current with
both LDOs enabled. The TPS719xx also provides an
active pulldown circuit to quickly discharge output
loads. The TPS718xx and TPS719xx are stable with
ceramic capacitors and use an advanced BiCMOS
fabrication process to yield a typical dropout voltage
of 230mV at 200mA output loads. The TPS718xx and
TPS719xx also use a precision voltage reference and
feedback loop to achieve 3% overall accuracy over all
load, line, process, and temperature variations. Both
families of devices are fully specified from T_J = –40°C
to +125°C and are offered in 2mm × 2mm SON-6 and
6-ball Wafer Chip-Scale (WCSP) packages that are
ideal for applications such as mobile handsets and
WLAN that require good thermal dissipation while
maintaining a very small footprint.
2.7V to 6.5V
V_IN
IN
0.9V to 3.6V
OUT1
V_OUT
1mF
On
Off
TPS718xx
1mF
TPS719xx
EN1
0.9V - 3.6V
OUT2
V_OUT
On
1mF
EN2
Off
GND
TPS718xx, TPS719xx
DRV Package
2mm x 2mm SON-6
(Top View)
OUT1 1
IN 2
OUT2 3
GND
6 EN1
5 GND
4 EN2
TPS718xx, TPS719xx
YZC Package
6-BALL WCSP
(Top View)
C2 C1
EN1
B2 B1
GND
A2 A1
EN2
OUT1
IN
OUT2
TPS718Axx, TPS719Axx
YZC Package
6-BALL WCSP
(Top View)
A1 A2
EN1
OUT1
B1 B2
GND
IN
C1 C2
EN2
OUT2
Typical Application Circuit
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
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All other trademarks are the property of their respective owners.
3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated