TPS65910_14 Datasheet, PDF (1/97 Pages) Texas Instruments – Integrated Power Management Unit Top Specification

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TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103
TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109
SWCS046T – MARCH 2010 – REVISED SEPTEMBER 2013
Integrated Power Management Unit Top Specification
Check for
Samples: TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103, TPS659104, TPS659105, TPS659106,
TPS659107, TPS659108, TPS659109
FEATURES
1
The purpose of the TPS65910 device is to
provide the following resources:
• Embedded power controller
• Two efficient step-down dc-dc converters for
processor cores
• One efficient step-down dc-dc converter for I/O
power
• One efficient step-up 5-V dc-dc converter
• SmartReflex™ compliant dynamic voltage
management for processor cores
• 8 LDO voltage regulators and one RTC LDO
(internal purpose)
• One high-speed I²C interface for general-
purpose control commands (CTL-I²C)
• One high-speed I²C interface for SmartReflex
Class 3 control and command (SR-I²C)
• Two enable signals multiplexed with SR-I²C,
configurable to control any supply state and
processor cores supply voltage
• Thermal shutdown protection and hot-die
detection
• A real-time clock (RTC) resource with:
– Oscillator for 32.768-kHz crystal or 32-kHz
built-in RC oscillator
– Date, time and calendar
– Alarm capability
• One configurable GPIO
• DC-DC switching synchronization through
internal or external 3-MHz clock
APPLICATIONS
• Portable and handheld systems
• OMAP3 power management
DESCRIPTION
The TPS65910 is an integrated power-management
IC available in 48-QFN package and dedicated to
applications powered by one Li-Ion or Li-Ion polymer
battery cell or 3-series Ni-MH cells, or by a 5-V input;
it requires multiple power rails. The device provides
three step-down converters, one step-up converter,
and eight LDOs and is designed to support the
specific power requirements of OMAP-based
applications.
Two of the step-down converters provide power for
dual processor cores and are controllable by a
dedicated class-3 SmartReflex interface for optimum
power savings. The third converter provides power for
the I/Os and memory in the system.
The device includes eight general-purpose LDOs
providing a wide range of voltage and current
capabilities; they are fully controllable by the I²C
interface. The use of the LDOs is flexible; they are
intended to be used as follows: Two LDOs are
designated to power the PLL and video DAC supply
rails on the OMAP based processors, four general-
purpose auxiliary LDOs are available to provide
power to other devices in the system, and two LDOs
are provided to power DDR memory supplies in
applications requiring these memories.
In addition to the power resources, the device
contains an embedded power controller (EPC) to
manage the power sequencing requirements of the
OMAP systems and an (RTC).
Figure 1 shows the top-level diagram of the device.
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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