TPS543C20 Datasheet, PDF (1/48 Pages) Texas Instruments – 4 Vin to 16 Vin, 40-A Stackable, Synchronous Step-down SWIFT Converter with Adaptive Internal Compensation

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TPS543C20
SLUSCD4 – MARCH 2017
TPS543C20 4 Vin to 16 Vin, 40-A Stackable, Synchronous Step-down SWIFT™ Converter
with Adaptive Internal Compensation
1 Features
•1 Internally-compensated Advanced Current Mode
Control 40A POL
• Input Voltage Range: 4.0-V to 16.0-V
• Output Voltage Range: 0.6-V to 5.5-V
• Integrated 3.0/0.9-mΩ Stacked NexFET™ Power
Stage with lossless Low-Side current sensing
• Fixed Frequency - Synchronization to an External
Clock and/ or Sync Out
• Pin Strapping Programmable Switching Frequency
– 300 kHz to 2 MHz for Standalone
– 300 kHz to 1 Mhz for Stackable
• Stack 2X for up to 80A with Current share,
Voltage share, and CLK Sync
• Pin Strapping Programmable Reference from 0.6
V to 1.1 V with 0.5% Accuracy
• Differential Remote Sensing
• Safe Start-Up into Pre-Biased Output
• High accuracy Hiccup Current Limit
• Asynchronous Pulse Injection (API) and Body
Braking
• 40-pin, 5-mm × 7-mm LQFN Package with 0.5-
mm Pitch and Single Thermal Pad
• Create a Custom Design Using the TPS543C20
With the WEBENCH^® Power Designer
2 Applications
• Wireless and Wired Communications
Infrastructure equipment
• Enterprise Servers, Switches, and Routers
• Enterprise Storage, SSD
• ASIC, SoC, FPGA, DSP Core and I/O Rails
3 Description
The TPS543C20 employs an internally compensated
emulated peak current mode control, with a clock
synchronizable, fixed frequency modulator for EMI-
sensitive POL. The internal integrator and directly
amplifying ramp tracking loop eliminate the need for
external compensation over a wide range of
frequencies thereby making the system Design
flexible, dense, and simple. Optional API and Body
Braking help improve transient performance by
significantly reducing undershoot and overshoot,
respectively. Integrated NexFET™ MOSFETs with
low-loss switching facilitate high efficiency and deliver
up to 40 A in a 5 mm x 7 mm PowerStack™ package
with a layout friendly thermal pad. Two TPS543C20
devices can be stacked together to provide up to 80-
A point-of-load.
Device Information⁽¹⁾
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS543C20
RVF (40)
5.00 mm × 7.00
1. For all available packages, see the orderable
addendum at the end of the data sheet.
4 Simplified Schematic
ILIM
RAMP
RT
VSEL
SS
MODE
AGND
TPS543C20
RSP
RSN
BOOT
SW
BP
PGND
GND
V_IN
V_OUT
+
LOAD
t
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.