TPS50601-SP Datasheet, PDF (1/40 Pages) Texas Instruments – 6-A Synchronous Buck Converter

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TPS50601-SP
SLVSD45 – DECEMBER 2015
TPS50601-SP Radiation Hardened 1.6- to 6.3-V Input, 6-A Synchronous Buck Converter
1 Features
•1 5962R10221:
– Radiation Hardness Assurance (RHA) up to
TID 100 krad (Si)
– ELDRS Free 100 krad (Si) – 10 mRAD(Si)/s
– Single Event Latchup (SEL) Immune to
LET = 85 MeV-cm²/mg (See Radiation Report)
– SEB and SEGR Immune to 85 MeV-cm²/mg,
SOA Curve Available (See Radiation Report)
– SET/SEFI Cross-Section Plot Available (See
Radiation Report)
• Peak Efficiency: 95% (V_O = 3.3 V)
• Integrated 55-mΩ/50-mΩ MOSFETs
• Split Power Rail: 1.6 to 6.3 V on PVIN
• Power Rail: 3 to 6.3 V on VIN
• 6-A Maximum Output Current
• Flexible Switching Frequency Options:
– 100-kHz to 1-MHz Adjustable Internal
Oscillator
– External Sync Capability: 100 kHz to 1 MHz
– Sync Pin can be Configured as a 500-kHz
Output for Master/Slave Applications
• 0.795-V ±1.258% Voltage Reference at 25°C
• Monotonic Start-Up into Prebiased Outputs
• Adjustable Soft Start Through External Capacitor
• Input Enable and Power-Good Output for Power
Sequencing
• Power Good Output Monitor for Undervoltage and
Overvoltage
• Adjustable Input Undervoltage Lockout (UVLO)
• 20-Pin Thermally-Enhanced Ceramic Flatpack
Package (HKH)
• See www.ti.com/swift for SWIFT™ Documentation
• See the Tools & Software Tab
2 Applications
• Space Satellite Point of Load Supply for FPGAs,
Microcontrollers, and ASICs
• Space Satellite Payloads
• Radiation-Tolerant Applications
• Available in Military (–55°C to 125°C)
Temperature Range
• Engineering Evaluation (/EM) Samples are
Available⁽¹⁾
3 Description
The TPS50601-SP is a radiation hardened, 6.3-V, 6-
A synchronous step-down converter, which is
optimized for small designs through high efficiency
and integrating the high-side and low-side MOSFETs.
Further space savings are achieved through current
mode control, which reduces component count, and a
high switching frequency, reducing the inductor's
footprint. The devices are offered in a thermally
enhanced 20-pin ceramic, dual in-line flatpack
package.
Device Information⁽²⁾
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS50601-SP
CFP (20)
KGD⁽³⁾
7.38 × 12.70 mm
N/A⁽⁴⁾
(1) These units are intended for engineering evaluation only.
They are processed to a non-compliant flow (that is no burn-
in, and so forth) and are tested to temperature rating of 25°C
only. These units are not suitable for qualification, production,
radiation testing or flight use. Parts are not warranted for
performance on full MIL specified temperature range of –55°C
to 125°C or operating life.
(2) For all available packages, see the orderable addendum at
the end of the data sheet.
(3) Known good die
(4) Bare die in waffle pack
SPACE
SPACE
Efficiency vs Load Current, Vin = 5 V
1.00
0.95
Vo = 3.3 V
0.90
0.85
0.80
0.75
0.70
Vo = 1.2 V
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.00
1.00
2.00
3.00
4.00
5.00
6.00
IL- Load Current (A)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.