TPD2E007_14 Datasheet, PDF (1/12 Pages) Texas Instruments – 2-CHANNEL ESD-PROTECTION ARRAY FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES

TPD2E007
www.ti.com
SLVS796E – SEPTEMBER 2008 – REVISED AUGUST 2010
2-CHANNEL ESD-PROTECTION ARRAY
FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES
Check for Samples: TPD2E007
FEATURES
1
•2 ESD Protection Exceeds IEC61000-4-2
(Level 4)
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC 61000-4-2 Contact Discharge
– ±15-kV IEC 61000-4-2 Air-Gap Discharge
• 4.5-A Peak Pulse Current (8/20 ms Pulse)
• 15-pF Line to GND Capacitance
• Low 50-nA Leakage Current
• 2-Channel Device
• Space-Saving PicoStar™ and DCK Package
APPLICATIONS
• Cell Phones, PDAs
• Audio Interface Connections
• Consumer Electronics (DVR, Set-Top Box, TV)
• Industrial Interface (RS-232, RS-485, RS-422,
LVDS)
YFMG4 PACKAGE
(BOTTOM VIEW)
GND B1 B2 GND
IO1 A1 A2 IO2
0.8 mm × 0.8 mm (0.4 mm pitch)
YFMG4 PIN DESCRIPTIONS
TERMINAL
DESCRIPTION
NAME NO.
IO A1, A2 ESD-protection channel
GND B1, B2 Ground
DCK PACKAGE
(TOP VIEW)
IO1 1
IO2 2
3 GND
DESCRIPTION/ORDERING INFORMATION
This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for
wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or
negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal
integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board
space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to
provide system level ESD protection for the valuable internal ICs while placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages. The PicoStar™ package (YFMG4),
with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package
height is a key concern. The PicoStar™ package can be used in either embedded PCB board applications or in
surface mount applications. The industry standard DCK package offers straightforward board layout option in
legacy designs.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PicoStar is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2010, Texas Instruments Incorporated