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TPD1E10B09_14 Datasheet, PDF (1/14 Pages) Texas Instruments – Single Channel ESD Protection Device in 0402 Package
TPD1E10B09
www.ti.com
SLLSEB0B – FEBRUARY 2012 – REVISED OCTOBEER 2012
Single Channel ESD Protection Device in 0402 Package
Check for Samples: TPD1E10B09
FEATURES
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• Provides System Level ESD Protection for
Low-voltage IO Interface
• IEC 61000-4-2 Level 4
– ±20kV (Air-Gap Discharge),
– ±20kV (Contact Discharge)
• IEC 61000-4-5 (Surge): 4.5A (8/20µs)
• IO Capacitance 10pF (Typ)
• RDYN 0.5Ω (Typ)
• DC Breakdown Voltage ±9.5V (Min)
• Ultra Low Leakage Current 100nA (Typ)
• 13V Clamping Voltage (Max at IPP = 1A)
• Industrial Temperature Range: –40°C to 125°C
• Space Saving 0402 Footprint
(1mm x 0.6mm x 0.5mm)
APPLICATIONS
• Cell Phones
• eBook
• Portable Media Players
• Digital Camera
• Set-top-box
• Printers
• Handheld Electronics
DEVICE CONFIGURATION
DESCRIPTION
The TPD1E10B09 is a single channel ESD protection device in a small 0402 package. The device offers ±20KV
IEC air-gap, ±20KV contact ESD protection, and has an ESD clamp circuit with a back-to-back diode for bipolar
or bidirectional signal support. The 10pF line capacitance is suitable for a wide range of applications supporting
data rates up to 500Mbps. Typical application areas for the TPD1E10B09 are audio lines (microphone, earphone
and speakerphone), SD interface, keypad or other buttons, and VBUS pins of USB ports (ID).
The 0402 package is industry standard and convenient for component placement in space saving applications.
The TPD1E10B09 is characterized for operation over ambient air temperature of -40°C to 125°C.
TA
–40°C to 125°C
ORDERING INFORMATION
PACKAGE (1) (2)
ORDERABLE PART NUMBER
10000
Tape and reel
TPD1E10B09DPYR
TOP-SIDE MARKING
A_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated