TPD12S520_14 Datasheet, PDF (1/17 Pages) Texas Instruments – Single-Chip HDMI Receiver Port Protection and Interface Device

TPD12S520
www.ti.com
SLVS640D – OCTOBER 2007 – REVISED DECEMBER 2013
Single-Chip HDMI Receiver Port Protection and Interface Device
Check for Samples: TPD12S520
FEATURES
1
• Single-Chip ESD Solution for HDMI
• Supports HDMI 1.4 Data Rate
• 0.8-pF Capacitance for High-Speed TMDS
Lines
• 0.05-pF Matching Capacitance Between
Differential Signal Pair
• Integrated Level Shifting for Control Lines
• ±8-kV Contact Electrostatic Discharge (ESD)
Protection on External Lines
• 38-Pin TSSOP Provides Seamless Layout
Option With HDMI Connector
• 24-pin WQFN Package for Space Constrained
Applications
• Backdrive Protection
• Lead-Free Package
APPLICATIONS
• Video Interfaces
• Consumer Electronics
• Displays and Digital Televisions
• Handheld Displays
DESCRIPTION
The TPD12S520 is a single-chip electrostatic
discharge (ESD) solution for the high-definition
multimedia interface (HDMI) receiver port. In many
cases, the core ICs, such as the scalar chipset, may
not have robust ESD cells to sustain system-level
ESD strikes. In these cases, the TPD12S520
provides the desired system-level ESD protection,
such as the IEC61000-4-2 (Level 4) ESD, by
absorbing the energy associated with the ESD strike.
While providing ESD protection, the TPD12S520
adds little or no additional glitch in the high-speed
differential signals (see Figure 9 and Figure 10).
High-speed transition minimized directional signaling
(TMDS) lines add only 0.8-pF capacitance to the
lines. In addition, monolithic integrated circuit
technology ensures excellent matching between the
two-signal pairs of the differential line. This is a direct
advantage over discrete ESD clamp solutions where
variations between two different ESD clamps may
significantly degrade the differential signal quality.
5V_SUPPLY
LV_SUPPLY
GND
TMDS_D2+
TMDS_GND
TMDS_D2–
TMDS_D1+
TMDS_GND
TMDS_D1–
TMDS_D0+
TMDS_GND
TMDS_D0–
TMDS_CK+
TMDS_GND
TMDS_CK–
CE_REMOTE_IN
DDC_CLK_IN
DDC_DAT_IN
HOTPLUG_DET_IN
DBT PACKAGE
(TOP VIEW)
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NC
ESD_BYP
GND
TMDS_D2+
TMDS_GND
TMDS_D2–
TMDS_D1+
TMDS_GND
TMDS_D1–
TMDS_D0+
TMDS_GND
TMDS_D0–
TMDS_CK+
TMDS_GND
TMDS_CK–
CE_REMOTE_OUT
DDC_CLK_OUT
DDC_DAT_OUT
HOTPLUG_DET_OUT
RMN PACKAGE
(TOP VIEW)
HOTPLUG_DET_OUT
DCC_DAT_OUT 1
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23 HOTPLUG_DET_IN
DCC_CLK_OUT ₂
22 _{DDC_DAT_IN}
CE_REMOTE_OUT 3
21 DCC_CLK_IN
TMDS_CK- 4
20 CE_REMOTE_IN
TMDS_CK+ 5
GND 6
19 _{TMDS_D2-}
18 TMDS_D2+
TMDS_D0- 7
17 GND
TMDS_D0+ 8
16 TMDS_D1-
GND 9
15 _{TMDS_D1+}
GND ₁₀
14 _GND
ESD_BYP 11
13 _{LV_SUPPLY}
12
5V_SUPPLY
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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