TPA1517_17 Datasheet, PDF (1/23 Pages) Texas Instruments – 6-W STEREO AUDIO POWER AMPLIFIER

TPA1517
www.ti.com
SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007
6-W STEREO AUDIO POWER AMPLIFIER
FEATURES
• TDA1517P Compatible
• High Power Outputs (6 W/Channel)
• Surface Mount Availability 20-Pin Thermal
SOIC PowerPAD™
NE PACKAGE
(TOP VIEW)
IN1 1
SGND 2
SVRR 3
OUT1 4
PGND 5
OUT2 6
V_CC 7
M/SB 8
IN2 ⁹
GND/HS ¹⁰
20 GND/HS
19 GND/HS
18 GND/HS
17 GND/HS
16 GND/HS
15 GND/HS
14 GND/HS
13 GND/HS
12 _GND/HS
11 _GND/HS
• Thermal Protection
• Fixed Gain: 20 dB
• Mute and Standby Operation
• Supply Range: 9.5 V - 18 V
GND/HS
IN1
NC
SGND
SVRR
NC
OUT1
OUT1
PGND
GND/HS
DWP PACKAGE
(TOP VIEW)
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
GND/HS
IN2
NC
M/SB
V_CC
NC
OUT2
OUT2
PGND
GND/HS
Cross Section View Showing PowerPAD
NC – No internal connection
DESCRIPTION
The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W
per channel of continuous average power into a 4-Ω load at 10% THD+N or 5 W per channel at 1% THD+N.
The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive
applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package
(DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal
characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).
AVAILABLE OPTIONS
T_A
-40°C to 85°C
PACKAGED DEVICES⁽¹⁾
THERMALLY ENHANCED
PLASTIC DIP
THERMALLY ENHANCED
SURFACE MOUNT (DWP)⁽²⁾
TPA1517NE
TPA1517DWP ⁽²⁾
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
(2) The DWP package is available taped and reeled. To order a taped and reeled part, add the suffix R
(e.g., TPA1517DWPR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2007, Texas Instruments Incorporated