TMS37145 Datasheet, PDF (1/5 Pages) Texas Instruments – DIGITAL SIGNATURE TRANSPONDER WITH INTEGRATED DST80 AUTHENTICATION, EEPROM, AND LF IMMOBILIZER

TMS37145
www.ti.com
SCBS879 – MAY 2012
DIGITAL SIGNATURE TRANSPONDER
WITH INTEGRATED DST80 AUTHENTICATION, EEPROM, AND LF IMMOBILIZER
Check for Samples: TMS37145
FEATURES
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• Low-Frequency (LF) Immobilizer Interface
– 75-Byte EEPROM
– 80-Bit DST80 Security Authentication
Coprocessor
– Integrated Batteryless Immobilizer Interface
– Half Duplex (HDX) Immobilizer
Communication Achieves up to 4-in (10-cm)
Read Range
– Special Selective Addressing Mode Allows
Reliable Learn-In Sequence
– 80-Bit Authentication Key Length
– Up to 8-kbit/s Uplink Data Rate
– 5-/3-Byte Challenge/Response Algorithm
– Fast Authentication Within 42 ms
– Fast Mutual Authentication Within 65 ms
– 75-Byte EEPROM
– 48-Byte Available EEPROM User
Memory
– 32-Bit Unique Serial Number
– High EEPROM Security and Flexibility
– Write-Only Authentication Keys
– Pages Are Irreversibly Lockable and
Protectable
– Protected Pages Programmable Only
Through Mutual Authentication
– Each User Page is Lockable
– Resonant Frequency: 134.2 kHz
DESCRIPTION
This new generation of security RFID transponder provides the highest level of security with its integrated 80-bit
encryption algorithm. The 5-byte challenge and 3-byte response algorithm is backward compatible with existing
TI products and provides, together with the burst length coding, short encryption telegram times.
The DST80 offers 65 bytes of free programmable user data stored in nine pages, each of them lockable for
programming. Each of the two 80-bit encryption keys with can be programmed with a single telegram.
The DST80 comes in two versions, preprogrammed with either PWM or PPM communication formats, eliminating
the need for the user to change this field.
T_A
-40°C to 85°C
PACKAGE ⁽²⁾
Wedge
Ordering Information⁽¹⁾
COMMUNICATION
FORMAT
ORDERABLE PART NUMBER
PWM
TMS37145TEAIE
PPM
TMS37145TEAIEG
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
WEDGE PACKAGE
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated