TM2CN64EFH Datasheet, PDF (1/15 Pages) Texas Instruments – SYNCHRONOUS DYNAMIC RAM MODULES

TM2CN64EFH 2ā097ā152 BY 64ĆBIT
TM4CN64EFH 4ā194ā304 BY 64ĆBIT
SYNCHRONOUS DYNAMIC RAM MODULES
SMMS715 − MAY 1998
D Organization:
− TM2CN64EFH . . . 2 097 152 x 64 Bits
− TM4CN64EFH . . . 4 194 304 x 64 Bits
D Single 3.3-V Power Supply
(±10% Tolerance)
D Designed for 66-MHz 4-Clock Systems
D JEDEC 168-Pin Dual-In-Line Memory
Module (DIMM) Without Buffer for Use With
Socket
D TM2CN64EFH — Uses Eight 16M-Bit
(2M × 8-Bit) Synchronous Dynamic RAMs
(SDRAMs) in Plastic Thin Small-Outline
Packages (TSOPs)
D TM4CN64EFH — Uses Sixteen 16M-Bit
(2M × 8-Bit) SDRAMs in Plastic TSOPs
D Byte-Read/Write Capability
D Performance Ranges:
D High-Speed, Low-Noise, Low-Voltage TTL
(LVTTL) Interface
D Read Latencies 2 and 3 Supported
D Support Burst-Interleave and
Burst-Interrupt Operations
D Burst Length Programmable to 1, 2, 4,
and 8
D Two Banks for On-Chip Interleaving
(Gapless Access)
D Ambient Temperature Range
0°C to 70°C
D Electroless Gold-Finished Contacts
D Pipeline Architecture
D Serial Presence Detect (SPD) Using
EEPROM
SYNCHRONOUS
CLOCK CYCLE
TIME
(CtLC=K33)^†
tCK2
(CL = 2)
’xCN64EFH-10
10 ns
† _{CL = CAS latency}
15 ns
ACCESS TIME
CLOCK TO
OUTPUT
tAC3
tAC2
(CL = 3) (CL = 2)
7.5 ns 7.5 ns
REFRESH
INTERVAL
64 ms
description
The TM2CN64EFH is a 16M-byte, 168-pin dual-in-line memory module (DIMM). The DIMM is composed of
eight TMS626812BDGE 2097 152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic thin small-outline package
(TSOP) mounted on a substrate with decoupling capacitors. See the TMS626812B data sheet (literature
number SMOS693).
The TM4CN64EFH is a 32M-byte, 168-pin DIMM. The DIMM is composed of sixteen TMS626812BDGE
2 097 152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic TSOP mounted on a substrate with decoupling
capacitors.
operation
The TM2CN64EFH operates as eight TMS626812BDGE devices that are connected as shown in the
TM2CN64EFH functional block diagram. The TM4CN64EFH operates as sixteen TMS626812BDGE devices
connected as shown in the TM4CN64EFH functional block diagram.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
Copyright  1998, Texas Instruments Incorporated
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