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TM124BBK32F_09 Datasheet, PDF (1/9 Pages) Texas Instruments – 32-BIT DYNAMIC RAM MODULE
TM124BBK32F, TM124BBK32U 1ā048ā576 BY 32ĆBIT DYNAMIC RAM MODULE
TM248CBK32F, TM248CBK32U 2ā097ā152 BY 32ĆBIT DYNAMIC RAM MODULE
D Organization
TM124BBK32F . . . 1 048 576 × 32
TM248CBK32F . . . 2 097 152 × 32
D Single 5-V Power Supply (±10% Tolerance)
D 72-Pin Single-In-Line Memory Module
(SIMM) for Use With Socket
D TM124BBK32F − Utilizes Two 16-Megabit
DRAMs in Plastic Small-Outline J-Lead
(SOJ) Packages
D TM248CBK32F − Utilizes Four 16-Megabit
DRAMs in Plastic Small-Outline J-Lead
(SOJ) Packages
D Long Refresh Period
16 ms (1024 Cycles)
D All Inputs, Outputs, Clocks Fully TTL
Compatible
D 3-State Output
D Common CAS Control for Eight Common
Data-In and Data-Out Lines in Four Blocks
D Enhanced Page-Mode Operation With
CAS-Before-RAS ( CBR), RAS-Only, and
Hidden Refresh
SMMS649A − DECEMBER 1994 − REVISED JUNE 1995
D Presence Detect
D Performance Ranges:
ACCESS
TIME
tRAC
(MAX)
ACCESS ACCESS READ
TIME TIME OR
tAA
tCAC WRITE
CYCLE
(MAX) (MAX) (MIN)
’124BBK32F-60 60 ns
30 ns 15 ns 110 ns
’124BBK32F-70 70 ns
35 ns 18 ns 130 ns
’124BBK32F-80 80 ns
40 ns 20 ns 150 ns
’248CBK32F-60 60 ns
30 ns 15 ns 110 ns
’248CBK32F-70 70 ns
35 ns 18 ns 130 ns
’248CBK32F-80 80 ns
40 ns
D Low Power Dissipation
20 ns 150 ns
D Operating Free-Air Temperature Range
0°C to 70°C
D Gold-Tabbed Versions Available:†
− TM124BBK32F
− TM248CBK32F
D Tin-Lead (Solder) Tabbed Versions
Available:
− TM124BBK32U
− TM248CBK32U
description
TM124BBK32F
The TM124BBK32F is a 32-megabit dynamic random-access memory (DRAM) organized as four times
1 048 576 × 8 in a 72-pin SIMM. The SIMM is composed of two TMS418160DZ, 1 048 576 × 16-bit DRAMs, each
in a 42-lead plastic SOJ package mounted on a substrate with decoupling capacitors. The TMS418160DZ is
described in the TMS418160 data sheet. The TM124BBK32F SIMM is available in the single-sided BK-leadless
module for use with sockets.
TM248CBK32F
The TM248CBK32F is a 64-megabit DRAM organized as four times 2 097 152 × 8 in a 72-pin SIMM. The SIMM
is composed of four TMS418160DZ, 1 048 576 × 16-bit DRAMs, each in a 42-lead plastic SOJ package
mounted on a substrate with decoupling capacitors. The TMS418160DZ is described in the TMS418160 data
sheet. The TM248CBK32F SIMM is available in the double-sided BK-leadless module for use with sockets.
operation
The TM124BBK32F operates as two TMS418160DZs connected as shown in the functional block diagram and
Table 1. The TM248CBK32F operates as four TMS418160DZs connected as shown in the functional block
diagram and Table 1. The common I / O feature dictates the use of early-write cycles to prevent contention on
D and Q.
† Part numbers in this data sheet are for the gold-tabbed version; the information applies to both gold-tabbed and solder-tabbed versions.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  1995, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
• POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
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