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TLV9061_17 Datasheet, PDF (1/30 Pages) Texas Instruments – 10-MHz, RRIO, CMOS Operational Amplifiers for Cost-Sensitive Systems | |||
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TLV9061, TLV9062, TLV9064
SBOS839A â MARCH 2017 â REVISED JUNE 2017
TLV906x 10-MHz, RRIO, CMOS Operational Amplifiers for Cost-Sensitive Systems
1 Features
â¢1 Rail-to-Rail Input and Output
⢠Low Input Offset Voltage: ±0.3 mV
⢠Unity-Gain Bandwidth: 10 MHz
⢠Low Broadband Noise: 10 nV/âHz
⢠Low Input Bias Current: 0.5 pA
⢠Low Quiescent Current: 538 µA
⢠Unity-Gain Stable
⢠Internal RFI and EMI Filter
⢠Operational at Supply Voltages as Low as 1.8 V
⢠Easier to Stabilize with Higher Capacitative Load
Due to Resistive Open-Loop Output Impedance
⢠Extended Temperature Range: â40°C to +125°C
2 Applications
⢠E-Bikes
⢠Smoke Detectors
⢠HVAC: Heating, Ventilating, and Air Conditioning
⢠Motor Control: AC Induction
⢠Refrigerators
⢠Wearable Devices
⢠Laptop Computers
⢠Washing Machines
⢠Sensor Signal Conditioning
⢠Power Modules
⢠Barcode Scanners
⢠Active Filters
⢠Low-Side Current Sensing
Single-Pole, Low-Pass Filter
RG
RF
3 Description
The TLV9061 (single), TLV9062 (dual), and TLV9064
(quad) are single-, dual-, and quad- low-voltage (1.8
V to 5.5 V) operational amplifiers (op amps) with rail-
to-rail input- and output-swing capabilities. These
devices are highly cost-effective solutions for
applications where low-voltage operation, a small
footprint, and high capacitative load drive are needed.
Although the capacitative load drive of the TLV906x
is 100 pF, the resistive open-loop output impedance
makes it easy to stabilize with much higher capacitive
loads. These op amps are designed specifically for
low-voltage operation (1.8 V to 5.5 V) with
performance specifications similar to the OPAx316
and TLVx316 devices.
The TLV906x family helps simplify system design,
because it is unity-gain stable, integrates the RFI and
EMI rejection filter and provides no phase reversal in
overdrive condition.
Micro-size packages, such as SOT553 and WSON,
are offered for all the channel variants (single, dual
and quad), along with industry-standard packages,
such as SOIC, MSOP, SOT-23 and TSSOP.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOT-23 (5)
1.60 mm à 2.90 mm
TLV9061
SC70 (5)
SOT553 (5)
1.25 mm à 2.00 mm
1.65 mm x 1.20 mm
SOIC (8)
3.91 mm à 4.90 mm
SOIC (8)
3.91 mm à 4.90 mm
TLV9062
WSON (8)
VSSOP (8)
2.00 mm x 2.00 mm
3.00 mm à 3.00 mm
VSSOP (10)
3.00 mm à 3.00 mm
TLV9064
SOIC(14)
TSSOP (14)
8.65 mm à 3.91 mm
4.40 mm à 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Small-Signal Overshoot vs Load Capacitance
60
50
R1
VIN
C1
( ( VOUT
VIN
=
1
+
RF
RG
1
1 + sR1C1
VOUT
f-3 dB =
1
2pR1C1
40
30
20
10
0
0
Overshoot+
Overshoot-
50
100
150
200
250
300
Capacitive Load (pF)
C025
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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