TLV5610IYZ Datasheet, PDF (1/16 Pages) Texas Instruments – DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green

BurrĆBrown Products
from Texas Instruments
TLV5610IYZ
SBAS389A – JULY 2006 – REVISED JULY 2006
2.7V to 5.5V, 12-Bit, Octal
DIGITAL-TO-ANALOG CONVERTER
in a Wafer Chip-Scale Package—Pb-Free/Green
FEATURES
• Eight, 12-Bit, Voltage Output DACs in One
Package
• Pin-Compatible, Pb-Free, RoHS-Compliant
Upgrade to the TLV5610IYE
• Programmable Settling Time versus Power
Consumption:
– 1µs in Fast Mode
– 3µs in Slow Mode
• Compatible With TMS320™ DSP Family and
SPI™ Serial Ports
• Differential and Single-Ended Analog
Input/Output
• Separate Software Control for ADC and DAC
Power Down
• Monotonic Over Temperature
• Low Power Consumption:
– 18mW in Slow Mode at 3V
– 48mW in Fast Mode at 3V
• Power Down Mode
• Buffered, High-Impedance Reference Inputs
• Data Output for Daisy-Chaining
APPLICATIONS
• Digital Servo-Control Loops
• Digital Offset and Gain Adjustment
• Industrial Process Control
• Machine and Motion Control Devices
• Mass Storage Devices
WAFER CHIP-SCALE PACKAGE
(BOTTOM VIEW)
MODE
OUTD
LDAC
REF
OUTC
OUTB
DOUT
DV_DD
DGND
DIN
18 17 16
19
20
1
2
34 56
15
14
13
12
11
10
9
78
OUTA
AV_DD
AGND
OUTH
FS
OUTE
OUTG
SCLK
PRE
OUTF
DESCRIPTION
The TLV5610IYZ is the lead-free version of the TLV5610IYE, an eight-channel, 12-bit, voltage output
digital-to-analog converter (DAC) with a flexible serial interface. The serial interface allows glueless interface to
TMS320 and SPI, QSPI™, and Microwire™ serial ports. It is programmed with a 16-bit serial string containing
four control and 12 data bits.
Additional features include a power-down mode, an LDAC input for simultaneous update of all eight DAC
outputs, and a data output that can be used to cascade multiple devices.
The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to
allow the designer to optimize speed versus power dissipation. The buffered, high-impedance reference input
can be connected to the supply voltage.
The TLV5610IYZ is implemented in a CMOS process and is available in a 20-terminal wafer chip-scale package
(WCSP). The TLV5610IYZ is characterized for operation from –40°C to +85°C in a wire-bonded small outline
(SO) package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320 is a trademark of Texas Instruments, Inc.
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corp.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated