TLV320DAC3202 Datasheet, PDF (1/19 Pages) Texas Instruments – LOW POWER HIGH FIDELITY I2S INPUT HEADSET IC

TLV320DAC3202
www.ti.com
SLAS726B – SEPTEMBER 2010 – REVISED MARCH 2012
LOW POWER HIGH FIDELITY I²S INPUT HEADSET IC
Check for Samples: TLV320DAC3202
FEATURES
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• Ground Referenced Click-Pop Free Class-G
Stereo Headset Driver
• Capable of Driving 1 VRMS at the Headset
Driver Output, Per Channel, in Phase
• 100-dB(A) Channel SNR With 6.5-mW of
Quiescent Power Dissipation
• Built In Short-Circuit Protection for Preventing
Supply Rails Overload
• Supports 8-, 11.025-, 12-, 16-, 24-, 32-, 44.1-
and 48-kHz Sample Rates
• I²C Interface for Digital Control
• Supports 16-, 20-, 24- and 32-Bit Data Width
• Supports Standard I²S, PCM, Left and Right
Justified Formats
• Supports Data Mixing With Gain Options
• 32-Step Volume Control from 4 to -59 dB
• Clocking: Internal Clock Derived from I²S
BCLK
• Package: WCSP, 0.5 mm Pitch, 2 mm x 2.5 mm
• Power Supply: Direct Battery and IO Supply
APPLICATIONS
• Smart Phones and Music Phones
• Portable Navigation
• Personal Media Players
• PDAs
• Portable Game Consoles
• HDD and Flash-Based Portable Audio Players
DESCRIPTION
The TLV320DAC3202 is a high fidelity and low power headphone amplifier with integrated DAC and power rails.
The small solution size and highly efficient operation maximizes battery life and performance. The digital audio
interface supports industry standard formats such as I²S and PCM. Many features of this device such as volume
setting, data width and sampling rate are configurable for optimum flexibility and efficiency. The headset power
control automatically adjusts the rail voltage based on the input signal to maximize efficiency and performance.
The control interface uses an industry standard I²C controller for ease of operation and reduction in device pin
count.
T_A
–30ºC to 85ºC
Table 1. ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
Tape and reel of 250
YZJ
Tape and reel of 3000
TLV320DAC3202CYZJT
TLV320DAC3202CYZJR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) While this part number includes the YZJ package designator, it does not conform to the standard YZJ footprint. Only the drawings below
should be used for system design and not the YZJ drawing available from the TI Packaging website.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated