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TLV2231_08 Datasheet, PDF (1/30 Pages) Texas Instruments – Advanced LinCMOS RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
TLV2231, TLV2231Y
Advanced LinCMOS RAIL-TO-RAIL
LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
SLOS158D – JUNE 1996 – REVISED APRIL 2001
D Output Swing Includes Both Supply Rails
D Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz
D Low Input Bias Current . . . 1 pA Typ
D Fully Specified for Single-Supply 3-V and
5-V Operation
D Common-Mode Input Voltage Range
Includes Negative Rail
D High Gain Bandwidth . . . 2 MHz at
VDD = 5 V With 600-Ω Load
D High Slew Rate . . . 1.6 V/µs at VDD = 5 V
D Wide Supply Voltage Range
2.7 V to 10 V
D Macromodel Included
DBV PACKAGE
(TOP VIEW)
IN +
1
5
VDD+
VDD– /GND
2
IN –
3
4
OUT
description
The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of
bandwidth and 1.6 V/µs of slew rate for applications requiring good ac performance. The device exhibits
rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231
is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-Ω loads for
telecom applications.
With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that
is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage
paths. The OUT and IN – terminals are on the same end of the board for providing negative feedback. Finally,
gain setting resistors and the decoupling capacitor are easily placed around the package.
VI
GND
RI
1
IN +
4
VDD+
2
VDD/GND
V+
C
3
IN –
OUT 5
VO
RF
Figure 1. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2001, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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