TDA2E Datasheet, PDF (1/4 Pages) Texas Instruments – SoC Processor for Advanced Driver Assist SystemsTechnical Brief

Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
TDA2E
SPRT714 – OCTOBER 2015
TDA2E SoC Processor for Advanced Driver Assist Systems (ADAS) Technical Brief
1 Device Overview
1.1 Features
1
• Architecture Designed for ADAS Applications
• Video, Image, and Graphics Processing Support
– Full-HD Video (1920 × 1080p, 60 fps)
– Multiple Video Input and Video Output
• ARM^® Cortex^®-A15 Microprocessor Subsystem
• C66x Floating-Point VLIW DSP
– Fully Object-Code Compatible With C67x and
C64x+
– Up to Thirty-two 16 x 16-Bit Fixed-Point
Multiplies per Cycle
• Up to 512KB of On-Chip L3 RAM
• Level 3 (L3) and Level 4 (L4) Interconnects
• DDR3/DDR3L Memory Interface (EMIF) Module
– Supports up to DDR3-1333 (667MHz)
– Up to 4GB Across Two Chip Selects
• Two ARM Dual Cortex-M4 Image Processing Units
(IPUs)
• IVA-HD Subsystem
• Display Subsystem
– Display Controller With DMA Engine and up to
Three Pipelines
– HDMI Encoder: HDMI 1.4a and DVI 1.0
Compliant
• Single-Core PowerVR™ SGX544 3D GPU
• 2D-Graphics Accelerator (BB2D) Subsystem
– Vivante^® GC320 Core
• Video Processing Engine (VPE)
• One Video Input Port (VIP) Module
– Support for up to 4 Multiplexed Input Ports
• General-Purpose Memory Controller (GPMC)
• Enhanced Direct Memory Access (EDMA)
Controller
• 2-Port Gigabit Ethernet (GMAC)
– Up to Two External Ports, One Internal
• Sixteen 32-Bit General-Purpose Timers
• 32-Bit MPU Watchdog Timer
• Six High-Speed Inter-Integrated Circuit (I²C) Ports
• Ten Configurable UART/IrDA/CIR Modules
• Four Multichannel Serial Peripheral Interfaces
(MCSPIs)
• Quad SPI Interface (QSPI)
• SATA Interface
• Multichannel Audio Serial Port (MCASP)
• SuperSpeed USB 3.0 Dual-Role Device
• High Speed USB 2.0 Dual-Role Device
• High Speed USB 2.0 On-The-Go
• PCI Express^® 2.0 Port With Integrated PHY
– One 2-lane Gen2-Compliant Port
– or Two 1-lane Gen2-Compliant Ports
• Dual Controller Area Network (DCAN) Modules
– CAN 2.0B Protocol
• Up to 215 General-Purpose I/O (GPIO) Pins
• Real-Time Clock Subsystem (RTCSS)
• Power, Reset, and Clock Management
• On-Chip Debug With CTools Technology
• 28-nm CMOS Technology
• 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA
(ABC)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.