SN74LVTH241-EP Datasheet, PDF (1/9 Pages) Texas Instruments – 3.3-V ABT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

SN74LVTH241ĆEP
3.3ĆV ABT OCTAL BUFFER/DRIVER
WITH 3ĆSTATE OUTPUTS
SCBS767 − NOVEMBER 2003
D Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product-Change Notification
D Qualification Pedigree^†
D Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With 3.3-V
V_CC)
D Supports Unregulated Battery Operation
Down to 2.7 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
† _{Component qualification in accordance with JEDEC and industry}
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
description/ordering information
D I_off and Power-Up 3-State Support Hot
Insertion
D Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D Latch-Up Performance Exceeds 500 mA Per
JESD 17
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
PW PACKAGE
(TOP VIEW)
1OE 1
1A1 2
2Y4 3
1A2 4
2Y3 5
1A3 6
2Y2 7
1A4 8
2Y1 ⁹
GND ¹⁰
20 V_CC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 _1Y4
11 _2A1
This octal buffer/ driver is designed specifically for low-voltage (3.3-V) V_CC operation, with the capability to
provide a TTL interface to a 5-V system environment.
The SN74LVTH241 is organized as two 4-bit line drivers with separate output-enable (1OE, 2OE) inputs. When
1OE is low or 2OE is high, the device passes noninverted data from the A inputs to the Y outputs. When 1OE
is high or 2OE is low, the outputs are in the high-impedance state.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
When V_CC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V_CC through a pullup resistor
and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by
the current-sinking/current-sourcing capability of the driver.
This device is fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C TSSOP − PW
Tape and reel SN74LVTH241IPWREP LH241EP
‡ _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are}
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2003, Texas Instruments Incorporated
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