SN74LVC3G06_17 Datasheet, PDF (1/18 Pages) Texas Instruments – Triple Inverter Buffer/Driver With Open-Drain Outputs

SN74LVC3G06
www.ti.com
SCES364J – AUGUST 2001 – REVISED NOVEMBER 2013
Triple Inverter Buffer/Driver With Open-Drain Outputs
Check for Samples: SN74LVC3G06
FEATURES
1
•2 Available in the Texas Instruments NanoFree™
Package
• Supports 5-V V_CC Operation
• Input and Open-Drain Output Accepts
Voltages up to 5.5 V
• Max t_pd of 3.4 ns at 3.3 V
• Low Power Consumption, 10-μA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce) < 0.8 V
at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot) > 2 V at
V_CC = 3.3 V, T_A = 25°C
• I_off Supports Live Insertion, Partial-Power-
Down Mode and Back Drive Protection
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
This triple inverter buffer/driver is designed for 1.65-V
to 5.5-V V_CC operation.
The output of the SN74LVC3G06 is open drain and
can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-
AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using I_off. The I_off circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
1A
3Y
2A
GND
DCT PACKAGE
(TOP VIEW)
1
8
2
7
3
6
4
5
V_CC
1Y
3A
2Y
DCU PACKAGE
(TOP VIEW)
1A 1
3Y 2
2A 3
GND 4
8
V_CC
7 1Y
6 3A
5 2Y
YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2Y
2A ^{3 6} 3A
3Y ² 7 1Y
1A
1 8 _VCC
See mechanical drawings for dimensions.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated