SN74LVC2G240_16 Datasheet, PDF (1/17 Pages) Texas Instruments – Dual Buffer Driver With 3-State Outputs

SN74LVC2G240
www.ti.com
SCES208I – APRIL 1999 – REVISED NOVEMBER 2013
Dual Buffer Driver With 3-State Outputs
Check for Samples: SN74LVC2G240
FEATURES
1
•2 Available in the Texas Instruments NanoFree™
Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.6 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Supports Live Insertion, Partial-Power-
Down Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to
Translate Inputs From a Max of 5.5 V Down to
the V_CC Level
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
This dual buffer driver is designed for 1.65-V to 5.5-V
V_CC operation.
The SN74LVC2G240 device is designed specifically
to improve the performance and density of 3-state
memory address drivers, clock drivers, and bus-
oriented receivers and transmitters.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is organized as two 1-bit buffers/drivers
with separate output-enable (OE) inputs. When OE is
low, the device passes data from the A input to the Y
output. When OE is high, the outputs are in the high-
impedance state.
To ensure the high-impedance state during power up
or power down, OE should be tied to V_CC through a
pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the
driver.
This device is fully specified for partial-power-down
applications using I_off. The I_off circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
1OE
1A
2Y
GND
DCT PACKAGE
(TOP VIEW)
1
8
2
7
3
6
4
5
V_CC
2OE
1Y
2A
DCU PACKAGE
(TOP VIEW)
1OE 1
8
1A 2
7
2Y 3
6
GND 4
5
V_CC
2OE
1Y
2A
YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2A
2Y 3 6 1Y
1A 2 7 2OE
1OE
18
V_CC
See mechanical drawings for dimensions.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated