SN74LVC2G08-EP Datasheet, PDF (1/11 Pages) Texas Instruments – DUAL 2-INPUT POSITIVE-AND GATE

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SN74LVC2G08-EP
DUAL 2-INPUT POSITIVE-AND GATE
SGDS032 – SEPTEMBER 2007
FEATURES
1
• Controlled Baseline
– One Assembly
– One Test Site
– One Fabrication Site
• Enhanced Diminishing Manufacturing Sources
(DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree ⁽¹⁾
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 5.7 ns at 3.3 V
• Low Power Consumption, 10 μA Max I_CC
• ±24 mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce) <0.8 V at
V_CC = 3.3 V, T_A = 25°C
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
• Typical V_OHV (Output V_OH Undershoot) >2 V at
V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DCU PACKAGE
(TOP VIEW)
1A 1
1B 2
2Y 3
GND 4
8
V_CC
7 1Y
6 2B
5 2A
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual 2-input positive-AND gate is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC2G08 performs the Boolean function Y + A • B or Y + A ) B in positive logic.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–55°C to 125°C
PACKAGE ⁽²⁾
VSSOP – DCU
ORDERING INFORMATION⁽¹⁾
Reel of 3000
ORDERABLE PART NUMBER
SN74LVC2G08MDCUREP
TOP-SIDE MARKING
SBNM
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated