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SN74LVC2G07-EP Datasheet, PDF (1/9 Pages) Texas Instruments – DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SN74LVC2G07-EP
www.ti.com ....................................................................................................................................................................................................... SCES719 – MAY 2008
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
FEATURES
1
• Controlled Baseline
– One Assembly Site
– One Test Site
– One Fabrication Site
• Extended Temperature Performance of –55°C
to 125°C
• Enhanced Diminishing Manufacturing Sources
(DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree (1)
• Supports 5-V VCC Operation
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
• Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
• Max tpd of 5.7 ns at 3.3 V
• Low Power Consumption, 10 µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
1A
1
6 1Y
GND
2
5
VCC
2A
3
4 2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired
AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
TA
–55°C to 125°C
SOT (SC-70) – DCK
ORDERING INFORMATION(1)
PACKAGE (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Reel of 250 SN74LVC2G07MDCKTEP
CHC
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
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