SN74LVC1GX04_06 Datasheet, PDF (1/19 Pages) Texas Instruments – CRYSTAL OSCILLATOR DRIVER

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SN74LVC1GX04
CRYSTAL OSCILLATOR DRIVER
SCES581B – JULY 2004 – REVISED DECEMBER 2006
FEATURES
• Available in Texas Instruments NanoStar™
and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• One Unbuffered Inverter (SN74LVC1GU04)
and One Buffered Inverter (SN74LVC1G04)
• Suitable for Commonly Used Clock
Frequencies:
– 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,
25 MHz, 26 MHz, 27 MHz, 28 MHz
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
• Max t_pd of 2.4 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
NC
1
GND
2
6
5
Y
NC
GND
V_CC
X1
1
2
3
6
Y
NC 1 6 ^Y
X1 ^{3 4} X2
5
V_CC ^{GND 2}
X1 3
5 V_CC
4 X2
GND
DNU
PR^21EV₅₅^IEW
V_CC
Y
4 X2
X1
3
4
X2
See mechanical drawings for dimensions.
NC – No internal connection
DNU – Do not use
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1GX04 is designed for 1.65-V to 5.5-V V_CC operation. This device incorporates the
SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single
device. The LVC1GX04 is optimized for use in crystal oscillator applications.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC1GX04YEPR ⁽³⁾
SN74LVC1GX04YZPR ⁽³⁾
PREVIEW
PREVIEW
SOT (SOT-23) – DBV
Reel of 3000 SN74LVC1GX04DBVR
Reel of 250 SN74LVC1GX04DBVT
CX4_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1GX04DCKR
D2_
Reel of 250 SN74LVC1GX04DCKT
SOT (SOT-553) – DRL
Reel of 4000 SN74LVC1GX04DRLR
UC_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
(3) Package preview
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2006, Texas Instruments Incorporated